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A major hurdle for perovskite solar cells has been the sensitivity of the materials to ambient air during manufacturing, which typically requires energy-intensive, inert-gas environments. A groundbreaking solution comes from Nanchang University, where researchers developed a novel "laser annealing" technique.

Laser processing technologies, including ablation, engraving, and cutting, are fundamental to modern precision manufacturing. While they all utilize high-energy laser beams to interact with materials, they are distinguished by their core objectives, key process parameters, and resultant application scenarios. Understanding these differences is crucial for selecting the appropriate technology for specific industrial needs.

Laser ablation, a sophisticated material processing technology, has established itself as a cornerstone technique in precision marking and micro-fabrication. This process utilizes high-energy pulsed laser beams to selectively remove material from a surface through vaporization, achieving unparalleled accuracy in creating fine features and markings. As industries increasingly demand higher precision and minimal thermal impact, laser ablation continues to evolve, offering innovative solutions across various manufacturing sectors.

The global PV market is entering a quality‑first, system‑value era: growth is broadening across regions, technologies are differentiating by efficiency and aesthetics, and the industry is consolidating around higher standards and smarter manufacturing. For Lecheng, aligning product roadmaps with these structural trends—especially in high‑efficiency cell and module testing—can unlock sustained share gains and long‑term customer value in both established and emerging markets.

In the manufacturing of thin-film solar cells, such as perovskite cells, laser scribing (P1, P2, P3) and edge cleaning (P4) are critical processes that directly impact cell efficiency and production yield. Multi-beam synchronous processing technology stands as a pivotal innovation for enhancing manufacturing efficiency. LeCheng Intelligent, a leader in this field, achieves high-precision, high-throughput processing of large-area panels through advanced optical design, sophisticated motion control, and deep process integration.

From December 21st to 22nd, the "5th Global Calcium Titanate and Tandem Battery (Suzhou) Industrialization Forum", jointly organized by the Shanghai Solar Energy Society, the Administrative Committee of Changshu Economic and Technological Development Zone, and the Photovoltaic Leader Innovation Forum, was successfully held in Changshu, Jiangsu.

The printing industry is evolving with increasing demands for high-precision, high-efficiency, and environmentally friendlymanufacturing processes. Traditional mechanical scribing and chemical cleaning methodshave long been used, but the roll-to-roll (R2R) laser scribing & edge-cleaning systemis emerging as a disruptive technology.

Recently,Lecheng Intelligence Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Leco Smart") has received angel - round strategic investment from Shanghai DEK Print - Coating Equipment Co., Ltd. The funds from this round of financing will be mainly used for technology research and development, renovation of production sites, and procurement of testing equipment.

The rapid growth of flexible electronics—including flexible printed circuit boards (FPCs), organic light-emitting diodes (OLEDs), wearable sensors, and rollable displays—has driven demand for high-precision, high-throughput manufacturing solutions. Among these, the roll-to-roll (R2R) laser scribing & edge-cleaning systemhas emerged as a transformative technology, enabling non-contact, high-speed processingof thin, delicate materials.

As consumer electronics continue to evolve toward thinner, lighter, and more miniaturized designs, the demand for ultra-precise and efficient manufacturing processeshas never been greater. Laser drilling technologyhas emerged as a critical enabler in this transformation, allowing manufacturers to create micro-sized holesin materials like PCBs, glass, and flexible substrateswith unprecedented accuracy.