Comprehensive Technical Solutions for the Entire Field of Laser Precision Machining：

1. Laser Precision Marking

Full-material compatibility: Permanently marks metals, plastics, ceramics, glass, and more with micron-level precision

Advanced identifiers: Supports QR codes, serial numbers, and complex graphics engraving for traceability

Critical applications: Widely used in high-end traceability fields including electronic components, medical devices, and aerospace

2. Ultra-thin Glass Laser Precision Cutting

Breakthrough technology: Enables fragment-free cutting of 0.1–2mm ultra-thin glass, overcoming traditional limitations

Edge strength innovation: Proprietary thermal stress control boosts edge strength by 300%

Revolutionary solutions: Core technology for foldable displays, automotive screens, and photovoltaic substrates

3. High-Stability Laser Welding Systems

Dissimilar material expertise: Solves welding challenges for copper-aluminum alloys with ±5μm thermal deformation control

Customized key processes: Develops hermetic sealing for EV batteries and gas-tight welding for sensors

Industry-leading yield: Achieves **>99.8% welding yield** to enhance smart manufacturing efficiency

4. Micro-nano Laser Etching Equipment

Ultra-fine capabilities: Minimum line width of 5μm, supporting curved-surface super-fine patterning

High-end applications: Critical for semiconductor lead frames, PERC solar cells, and precision mold texturing

Technology driver: Accelerates R&D in flexible circuits and next-gen microelectronics

5. Laser Precision Cutting

(1) Metal Cutting

Accuracy: ≤10μm for metals (steel, aluminum, tungsten) under 2mm thickness.
Thermal control: Heat Affected Zone (HAZ) <30μm.
Applications: Medical implants, precision instruments

(2) PCB/FPC Circuit Board Cutting

Precision: ≤10μm accuracy with HAZ <30μm.
Technology: High-speed galvanometer scanners for efficiency

(3) Glass Cutting

Thickness range: 0.05–10mm; edge chipping <30μm.
Key uses: Display panels, photovoltaic substrates, hermetic glass lids

Lecheng_Intelligent_LED_Solar_Simulator.pptx

Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Lecheng Intelligence Technology (Suzhou) Co., Ltd. is strategically located in the vibrant industrial hub of Changshu Economic Development Zone. As a technology-driven enterprise specializing in laser processing equipment for the new energy sector, the company has embedded "technological innovation" into its core DNA since its inception. Committed to advancing the upgrade of the new energy industry, Lecheng continuously refines its expertise across the entire value chain—R&D, production, and after-sales service—for laser and automation equipment used in perovskite solar cells (PSCs). The company also provides complete perovskite solar cell production line solutions, establishing a prominent position within the industry through its professional capabilities.

Featured products

Multi-channel PV Module IV+MPPT Steady-State Test System

1. Multi-channel architecture enables parallel IV and MPPT testing. 2. Independent channel control ensures high-precision data acquisition. 3. Built-in MPPT algorithms handle perovskite hysteresis effectively. 4. Automated software supports long-term, unattended stability testing.

LC-LED-AAA-300S LED Solar Simulator

1. Optical shaping delivers true parallel light with <5° collimation. 2. Class A+ spectrum ensures accurate perovskite response testing. 3. Large 300×300 mm uniform area supports device and module research. 4. Dual steady and pulse modes enable efficiency and stability tests.

LC-SPV-ST-2525 Space Photovoltaic Module Stability Test System

1. Integrated AM0 light, thermal stage, and testing system in one cabinet. 2. Class A AM0 spectrum with extreme temperature simulation from -180°C to +150°C. 3. Multi-channel IV and MPPT testing enables high-throughput space PV evaluation. 4. Automated software supports 24/7 unattended stability and aging tests.

Roll-to-Roll Laser Scribing & Edge-Cleaning System

Precision Scribing: Achieve sub-micron accuracy for flawless thin-film patterning. High-Speed R2R Processing: Maximize throughput with continuous roll-to-roll automation. Non-Contact Edge Clearing: Eliminate micro-cracks & contamination, ensure clean edges. Versatile Material Handling: Process ITO, PET, PI, copper & more with ease.

Laser Etching Equipment

Ultrafine 5μm Laser Etching—Sub-micron precision for semiconductors & FPCs. 2000mm/s High-Speed Processing—4x faster vs chemical etching, zero waste. 200+ Material Compatibility—From glass to titanium alloys, non-contact. Intelligent HMI Control—Auto-focus & CAD integration, ISO certified.

Cabinet Laser Cleaning Machine

Fully enclosed design for safe, dust-free operation. High-power laser for fast rust & coating removal. Automated controls for precision cleaning results. Low maintenance, ideal for industrial applications.

HDI Microvia Drilling Equipment

Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.

Picosecond Glass Laser Cutting System

Cold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.

3D Laser Cutting Machine

Five-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.

Laser Glass Cutting & Breaking All-in-One Machine

Integrated laser scoring/breaking eliminates secondary processing. CO₂ laser creates smooth edges without micro-cracks. Patented force control ensures consistent 100μm accuracy.

Product advantages

Perovskite laser production line
Lecheng Intelligent is a leading expert in perovskite solar cell laser processing equipment. Specializing in high-precision laser scribing and edge deletion machines for perovskite PV production, their product lineup includes P1, P2, P3 laser scribing equipment and P4 edge isolation devices. Their systems feature real-time focus tracking, vision compensation, and multi-beam scribing capabilities, supporting up to 150MW production lines and enabling high efficiency with minimized dead zones for large-area perovskite modules.

More
Laser Scribing Equipment
Lecheng is one of the leading Laser scribing equipment manufacturer in China.
Lecheng Laser scribing equipment utilizes high-energy laser beams to create precise micro-cuts or grooves on materials such as silicon wafers, thin-film solar cells, ceramics, and metals (≤0.5 mm thickness). This non-contact process achieves micron-level accuracy (kerf width: 0.01–0.05 mm) through controlled ablation, enabling electrical isolation or segmentation in photovoltaic cells and semiconductor devices.
Key components of Laser scribing equipment include:
Laser Source: Fiber (1064 nm), UV (355 nm), or CO₂ (10.6 µm) lasers, selected for material compatibility and precision requirements.
Galvanometer Scanning System: High-speed mirrors (≤8,000 mm/s) for beam positioning with ±0.001 mm repeatability.
CNC Worktable: Automated vacuum adsorption platform for stable material handling.
Cooling System: Air or water cooling (precision: ±0.5°C) to maintain thermal stability.
Software: Compatible with CAD/CAM tools (e.g., AutoCAD, CorelDraw) for path programming and real-time monitoring.
As the leading Laser scribing equipment manufacturer, Lecheng offers the OEM service for our loyal customers worldwide.
More
Laser Edge Isolation Equipment
Laser Edge Cleaning Equipment - This system utilizes laser etching technology to perform the P4 edge cleaning process. It not only enables fixed-width edge scanning along all four sides of the substrate but also supports customized edge patterning in other specified areas based on unique product design requirements.
Key Features:
P4 Process Compatibility: Precision laser etching for edge isolation.
Flexible Processing: Handles both standard peripheral scanning and customized patterns.
Substrate Adaptability: Suitable for diverse materials and design specifications.
More
Laser Marking Equipment
Le Cheng provides high-performance laser marking equipment including fiber laser markers, CO2 engravers, and UV laser systems for metals, plastics, and electronics. Our CE-certified machines deliver permanent, high-speed marking with low maintenance. Ideal for automotive, aerospace, and medical industries. Free quote available!
More
Laser engraving machine
A laser engraving machine is an advanced technological device that utilizes a focused laser beam to create permanent marks, patterns, or designs on various materials through a process of melting, vaporizing, or inducing chemical changes on the surface. Operating similarly to a computer printer, it translates digital designs from software into precise physical engravings. These machines are highly versatile and can process a wide range of materials, including metals (e.g., stainless steel, aluminum), non-metals (e.g., wood, acrylic, glass, leather), plastics, and ceramics. They are valued for their high precision (up to 1000 DPI resolution), speed (e.g., engraving speeds up to 1000mm/s), and efficiency, enabling detailed and complex designs without physical contact, which eliminates tool wear and reduces material damage.
More
Photovoltaic Solar Testing Equipment
Photovoltaic Solar Testing Equipment Manufacturer: Lecheng Laser

Our advanced photovoltaic solar testing equipment is designed to ensure the quality, performance, and safety of solar energy systems. These professional testing instruments provide comprehensive evaluation of PV modules, including EL (Electroluminescent) testing, IV curve analysis, and steady-state performance measurement.
With user-friendly interfaces and robust data management capabilities, our photovoltaic solar testing equipment help optimize system design, improve energy conversion efficiency, and extend the operational lifespan of photovoltaic installations.

More
Laser Integrated Processing
Utilizing dual or triple optical path designs, laser integrated processing system is primarily used for the development and testing of laser processes on small-format thin-film solar cells. laser integrated processing system enables simultaneous execution of laser scribing (P1, P2, P3) and edge isolation (P4) processes for thin-film solar cells.
More
Laser Cutting Equipment
Laser cutting equipment utilizes a high-powered, focused laser beam to precisely cut, melt, or vaporize materials like metals, plastics, and wood. Guided by CNC systems, it offers exceptional accuracy, speed, and clean edges for various industrial applications.
More

Company Profile

-70px

-115px

Case

Demystifying Beam Splitting Technologies in Perovskite Photovoltaic Laser Processing

The transition to gigawatt-scale perovskite solar production hinges on precision laser processing, where beam splitting technology plays a pivotal role. By dividing a single laser source into multiple beams, this technique enables simultaneous scribing of P1-P3 patterns and edge isolation (P4), directly impacting throughput, dead zone control, and production costs. Current industrial approaches primarily include mechanical beam splitting and diffractive optical elements (DOEs), each with distinct advantages for perovskite’s thermal sensitivity and scalability requirements.

The Application of Laser Technology in the Industrialization of Perovskite Solar Cells

Perovskite solar cells (PSCs) represent the third generation of thin-film solar technology, renowned for their high efficiency, low cost, and flexibility. As industrialization progresses, laser technology has emerged as a critical enabler, addressing key challenges in precision processing and scalability. This article explores the multifaceted role of lasers in PSC manufacturing.

Roll-to-Roll (R2R) Laser Scribing System for Thin-Film Solar Cells

The equipment utilizes a high-energy-density laser beam, precisely controlled by a computer system, to process roll-to-roll thin-film solar cell materials according to pre-programmed scribing patterns. Through laser thermal or cold processing effects, the thin-film material is instantaneously vaporized, separated, or modified, achieving precise scribing to either segment the cells or create specific circuit patterns on them.

Perovskite Photovoltaic Module

Lecheng's laser scribing equipment, equipped with a high-precision laser control system, achieves micron-level patterning accuracy with smooth, thermally damage-free edges. This significantly reduces internal resistance losses in solar cells, pushing power conversion efficiency to industry-leading levels—perfectly meeting the high-power output demands of mass production.

High-Precision Laser Micromachining Equipment

Laser high-precision micromachining technology achieves material processing through precise control of core parameters such as wavelength, pulse width, and energy density, utilizing either thermal or cold processing mechanisms. This induces instantaneous material vaporization, melting, or modification, enabling operations such as cutting, drilling, engraving, and surface treatment. It stands as a pivotal technology in high-precision manufacturing.

Customer Acclaim

This prestigious accolade has significantly elevated Lecheng Intelligent's industry visibility and reputation, distinguishing it as a trusted leader among suppliers. The recognition solidifies its competitive edge and lays a robust foundation for market expansion.

Third-party witnessing

Lecheng Intelligent's laser equipment has successfully passed stringent audits conducted by top industry experts and earned this prestigious certification, thanks to its exceptional quality and cutting-edge technology. This honor not only signifies high recognition of its product performance but also serves as powerful validation of the company's R&D capabilities and innovation strength.

Products