Products

Picosecond cutting and CO2 breaking in one machine. High precision motion system ensures fine glass processing. CCD vision alignment improves positioning and yield. Designed for 300×300 mm glass with stable automation.

Dual-laser design enables cutting and breaking in one pass. Picosecond processing ensures clean edges with no cracks. High precision motion system delivers micron-level accuracy. Stable performance supports continuous industrial production.

Up to 100 channels enable unmatched test throughput. Real-time MPPT tracks true outdoor power performance. I-V sweeps and field data are recorded automatically. IP67 outdoor design supports long-term aging studies.

Multiple laser sources support more materials. Engraves wood, leather, acrylic, metal and fabric. Compact desktop design fits home or studio use. Easy software makes customization fast and simple.

Class AAA performance meets IEC testing standards. 2400×1200mm large area supports full module testing. ±2% uniformity ensures highly accurate results. Stable 1000W/m² output improves testing consistency.

Fully automatic thin film photovoltaic laser scribing equipment supports precise P1 P2 P3 patterning for PV module production. Stable laser processing helps improve cell consistency edge quality and production efficiency. Suitable for perovskite thin film solar and photovoltaic manufacturing lines.

Roll to roll laser scribing and edge cleaning supports continuous processing for flexible photovoltaic materials. The system improves production efficiency while keeping scribing lines stable and clean. Suitable for thin film PV flexible electronics and roll based laser processing projects.

High-efficiency thin-film solar production with precision automation. Modular design for flexible, scalable manufacturing solutions. Advanced coating tech ensures uniform, durable solar layers. Energy-saving systems reduce operational costs significantly.

Ultrafast laser scribing enhances solar cell production efficiency. Non-contact processing prevents silicon wafer micro-cracks. Automated alignment ensures ±5μm precision for all cell types.

Multi station laser marking and cutting system improves production efficiency through parallel processing. Automated positioning and stable laser control support consistent marking cutting and batch manufacturing. Suitable for electronics metal parts industrial components and customized production lines.