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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
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+86-17751173582Ultra-Precise Laser Scribing – Ensures micron-level accuracy for thin-film batteries. Fully Automated Operation – Boosts efficiency with 3-station loading/unloading. Multi-Beam Laser Tech – Supports 24-beam splitting for high-speed processing. Smart Monitoring System – Real-time HD observation for quality control.
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Cold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.
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Nanometer precision for flawless micro-scale machining. Ultrafast lasers enable clean, burr-free cuts. Multi-material compatibility for versatile applications. Automated focus control ensures consistent high quality.
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Five-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.
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Integrated laser scoring/breaking eliminates secondary processing. CO₂ laser creates smooth edges without micro-cracks. Patented force control ensures consistent 100μm accuracy.
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Ultrafast laser scribing enhances solar cell production efficiency. Non-contact processing prevents silicon wafer micro-cracks. Automated alignment ensures ±5μm precision for all cell types.
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Precision Scribing: Achieve sub-micron accuracy for flawless thin-film patterning. High-Speed R2R Processing: Maximize throughput with continuous roll-to-roll automation. Non-Contact Edge Clearing: Eliminate micro-cracks & contamination, ensure clean edges. Versatile Material Handling: Process ITO, PET, PI, copper & more with ease.
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LED simulator delivers precise AM1.5G output with stable irradiance. Adjustable intensity ensures flexible testing for PV materials. Real-time LED temperature control maintains consistent light quality. Clean interface enables easy spectral and irradiance adjustments.
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Multi-channel design enables parallel IV and MPPT testing. 3A LED simulator ensures stable AM1.5G illumination. Independent 25–100°C control keeps each module stable. Supports 50×50 to 300×300 mm modules for flexible testing.
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Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.
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80px
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582