40px
80px
80px
80px
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582Our state-of-the-art picosecond laser cutting system redefines precision glass processing with its innovative design:
Professional enclosure features dual-access observation doors with ergonomic handles for optimal workflow
Industrial control panel integrates high-resolution touchscreen with tactile buttons for precise parameter adjustment
Multi-status indicator tower provides instant visual feedback on machine operation
Space-saving footprint designed for seamless integration into production lines and cleanroom environments

Ultra-precise processing - Picosecond pulse technology achieves <10μm cutting accuracy
Flawless edge quality - Specialized beam delivery eliminates micro-cracks and chipping
Advanced material handling - Processes display glass (0.1-5mm), optical components, and specialty substrates
Smart monitoring system - Real-time process control ensures consistent results batch after batch

Consumer electronics - Precision cutting of cover glass for smartphones and tablets
Advanced displays - Bezel-free shaping of next-generation OLED/LCD panels
Optical engineering - Micro-structuring of lenses and optical filters
Automotive innovation - Cutting of heads-up display components with automotive-grade precision
Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.
MoreP-Series delivers industry-leading 120m/min cutting speed. Six-axis CNC control enables complex 3D pipe profiles. Automatic loading/unloading boosts production efficiency. Maintains ±0.1mm precision across all pipe diameters.
MoreFive-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.
MoreUltra-precise laser cutting for flexible OLED panels. Non-contact process prevents display layer damage. Automated alignment ensures micron-level cutting accuracy. Compact design fits cleanroom production environments.
MoreNon-contact laser cutting for zero material loss. High-precision slicing for superior wafer quality. Automated operation boosts production efficiency. Low thermal impact preserves SiC properties.
MoreVersatile Dual Function: Precision cutting AND engraving in one compact system. Non-Material Master: Perfectly processes wood, acrylic, leather, fabric, paper. User-Friendly Operation: Intuitive software & rapid setup for instant productivity. Industrial-Grade Results: Professional quality without industrial complexity.
MoreSpace-Saving Design: Compact benchtop unit fits any workshop or office. Precision Metal Cutting: Cuts steel, aluminum, copper with razor-sharp detail. Plug-&-Play Operation: User-friendly software, minimal training required. Industrial Performance: Professional results without industrial space needs.
MoreHigh-Power Fiber Laser: Delivers superior speed & cuts thick metals effortlessly. Exceptional Precision & Quality: Achieves clean, burr-free edges on intricate contours. Energy-Efficient & Cost-Effective: Low power consumption maximizes operational savings. Versatile & Reliable: Processes diverse metals (steel, aluminum, copper) with consistent results.
MoreUltrafine 5μm Laser Etching—Sub-micron precision for semiconductors & FPCs. 2000mm/s High-Speed Processing—4x faster vs chemical etching, zero waste. 200+ Material Compatibility—From glass to titanium alloys, non-contact. Intelligent HMI Control—Auto-focus & CAD integration, ISO certified.
MoreNanometer precision for flawless micro-scale machining. Ultrafast lasers enable clean, burr-free cuts. Multi-material compatibility for versatile applications. Automated focus control ensures consistent high quality.
More40px
80px
80px
80px
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582