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Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582Consumer Electronics Laser Drilling Equipment is designed for industrial laser processing projects that require stable beam control, process repeatability, and reliable integration with production requirements. For ├ Laser Integrated Processing selection, buyers should compare material type, processing accuracy, automation level, throughput, maintenance access, and after-sales support before confirming the final equipment configuration.
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Overview
Precision laser drilling system designed for smartphones, tablets and wearables. Utilizing UV laser technology, it achieves ±5μm accuracy on 0.05mm micro-vias across FR4, ceramic, FPC and glass substrates, meeting demands for miniaturized electronics manufacturing.

Feature | Performance | Value Proposition |
|---|---|---|
Ultra-Precision | ±5μm positioning | 99.98% yield rate |
High-Speed | 500 holes/sec | 3x productivity gain |
Smart Control | AI thermal compensation | 30% scrap reduction |
Multi-Material | FR4/Ceramic/FPC/Glass | <2min changeover |
Non-Contact:No mechanical stress damage
Micro-Drilling:0.05-0.3mm hole arrays
Eco-Friendly:70% energy saving, <65dB noise
Smartphones:HDI micro-vias/Camera alignment
TWS Earbuds:FPC irregular holes/Charging ports
Smartwatches:AMOLED display circuit vias



40px
80px
80px
80px
Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582