Laser Integrated Processing

Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.

Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.

Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.

Laser optics and accessories support stable beam delivery focusing and processing accuracy. High quality optical components help maintain laser system consistency and service life. Suitable for laser cutting marking scribing engraving and integrated processing equipment.