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Lecheng Intelligent Technology Suzhou
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+86-17751173582Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.
Consumer Electronics Laser Drilling EquipmentMicro Laser Drilling MachinePCB Microvia Drilling SystemPrecision Laser Drilling EquipmentConsumer Electronics Laser ProcessingEmailMore
Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.
PCB Laser Drilling Equipment for Precision Microvia ProcessingLaser PCB MicrodrillHigh-Speed PCB Hole DrillerCNC PCB Drilling SystemMulti-Spindle PCB DrillerEmailMore
Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
HDI Microvia Laser Drilling Equipment for PCB ManufacturingLaser PCB Drilling SystemHigh-Density Interconnect DrillerPrecision Micro-hole Drilling EquipmentPCB Laser Via MachineEmailMore
Laser optics and accessories support stable beam delivery focusing and processing accuracy. High quality optical components help maintain laser system consistency and service life. Suitable for laser cutting marking scribing engraving and integrated processing equipment.
Laser Optics and Accessories for Industrial Laser SystemsLaser AccessoriesOptical ComponentsLaser Processing PartsPrecision Laser ComponentsEmailMore
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Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582



















































