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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
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+86-17751173582Full range optics from lens to nozzle in one supply chain. Supports 1–30kW laser systems with stable performance. High transmittance coatings ensure minimal power loss. Fast delivery with OEM customization for global clients.
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Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
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Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.
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Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.
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80px
80px
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582