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  • Glass Laser Cutting And Breaking Machine
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Glass Laser Cutting And Breaking Machine

Dual-laser design enables cutting and breaking in one pass. Picosecond processing ensures clean edges with no cracks. High precision motion system delivers micron-level accuracy. Stable performance supports continuous industrial production.
  • LECHENG
  • Jiangsu China
  • 45days
  • 800

🔵 Glass Laser Cutting And Breaking Machine

High Precision Picosecond Laser Glass Processing Solution

Integrated Cutting + Breaking | Ultra Clean Edge | High Yield Production


Precision Glass Processing, Simplified

The Glass Laser Cutting And Breaking Machine is designed for manufacturers who require high-precision glass processing with stable quality and repeatable results. By integrating an infrared picosecond laser cutting system and a CO₂ laser breaking module into one platform, the machine enables a fully continuous workflow from cutting to separation without manual transfer.

Compared with conventional glass processing methods, this solution delivers cleaner edges, tighter dimensional tolerance, and higher yield, making it ideal for advanced manufacturing applications where consistency matters.

Glass Laser Cutting And Breaking Machine

Picosecond Laser Glass Cutting System

🔷 The Dual-Laser Advantage

Why Combine Picosecond and CO₂ Technologies

Glass cutting and glass separation are fundamentally different processes:

Stage 1: Picosecond Laser Cutting (1064nm)

  • Creates a controlled modification layer inside the glass

  • Cutting width: 5–20μm

  • No thermal damage due to ultra-short pulses

  • Defines the separation path precisely

Stage 2: CO₂ Laser Breaking (10.6μm)

  • Applies localized thermal stress along the cutting path

  • Enables controlled and clean separation

  • Produces vertical and smooth edges

👉 This dual-laser approach combines the strengths of both systems:

MethodLimitationResult
Picosecond OnlyRequires manual breakingInconsistent
CO₂ OnlyThermal stress & poor edgesLow precision
Dual-Laser SystemBest edge + high yield

🔷 Why Picosecond Laser Matters

Traditional mechanical cutting introduces:

  • Micro-cracks up to 100μm depth

  • Edge chipping 50–200μm

  • Limited shape flexibility

Picosecond laser technology solves these issues:

  • Cold ablation (no heat damage)

  • No mechanical stress

  • No melt residue

👉 Result:

  • Up to 300% higher edge strength

  • No secondary polishing needed

  • Consistent batch quality


🔷 Core Technology Overview

Dual Laser Configuration

ParameterPicosecond LaserCO₂ Laser
Power≥60 W>100 W
Wavelength1064 nm10.6 μm
Pulse Width<15 ps
Beam QualityM² ≤ 1.4M² < 1.3
Stability<2%<±5%
Lifetime>20,000 h>20,000 h

Precision Motion System

ParameterValue
Processing Area300 × 300 mm
Position Accuracy≤ ±10 μm
Repeatability±2 μm
Max Speed>500 mm/s

Key Technologies:

  • Linear motors (no backlash)

  • High-resolution encoders

  • Granite base for stability

👉 Ensures long-term precision without degradation

Laser Glass Cutting And Breaking Machine

Glass Laser Cutting And Breaking Machine

Picosecond Laser Glass Cutting System


Vision Alignment System

  • 5MP CCD camera

  • Automatic mark recognition

  • Alignment accuracy: ±5μm

  • Positioning time: 2–3 seconds

👉 Enables consistent batch production with minimal operator input


Smart Software System

  • DXF/DWG import

  • Automatic path optimization

  • Process database

  • Multi-layer parameter control

  • Real-time diagnostics

👉 Operators can reach basic proficiency in 2–3 days


🔷 Processing Performance

ParameterValue
Glass Thickness<10 mm
Cutting Speed≤500 mm/s
Breaking Speed≤100 mm/s
Cutting Width5 μm
Edge Chipping50–80 μm
Yield Rate99%

🔷 Real Production Examples

Mobile Device Glass

  • Thickness: 0.7 mm

  • Cycle time: 45 sec

  • Edge chipping: <15 μm

  • Output: 1500 pcs/day

Display Panel Glass

  • Thickness: 1.1 mm

  • Complex shape cutting

  • Edge strength: 80 MPa

  • No polishing required

Automotive Glass

  • Thickness: 3 mm

  • Clean edge finish

  • No post-processing needed

👉 These cases demonstrate real industrial viability


🔷 Machine Reliability

ParameterValue
Yield99%
Utilization Rate99%
Maintenance Time≤1 hour
MTBF≥200 hours

🔷 Maintenance Overview

ItemFrequencyTime
Optics Cleaning500 hours30 min
CalibrationMonthly1 hour
Laser Service10,000 hoursScheduled
Software UpdateAs needed15 min

👉 Annual cost: approx. $2,000–3,000


🔷 Application Range

  • Precision glass cutting

  • Photovoltaic glass processing

  • Consumer electronics glass

  • Automotive glass components

  • Optical glass parts

  • Advanced industrial glass manufacturing


🔵 Ready for Your Production Upgrade

If you are looking for:

✔ Cleaner edges
✔ Higher yield
✔ Lower processing cost
✔ Stable long-term production

👉 This machine provides a scalable and reliable solution


👉 Contact Us for Technical Details and Quotation


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  • How long does it take from equipment ordering to official production when cooperating with Locsen?

    The overall timeline varies depending on equipment specifications and production line scale. For standalone equipment, standard models require a 45-day manufacturing cycle, with total duration (including shipping and installation) of approximately 60 days. Customized equipment requires an additional 30 days based on technical requirements. For complete line solutions: • 100MW-level production lines require ~4 months for planning, equipment manufacturing, installation, and commissioning • GW-level production lines require ~8 months We provide detailed project schedules with dedicated managers ensuring seamless coordination. Example: A client's 1GW perovskite production line was completed 15 days ahead of schedule through parallel equipment manufacturing and facility construction.
  • Does Locsen offer suitable equipment and partnership solutions for startup perovskite companies

    Locsen offers a "Phased Partnership Program" specifically designed for perovskite startups. For the initial R&D phase, we provide compact pilot-scale equipment (e.g., 10MW laser scribing systems) bundled with essential process packages to facilitate technology validation and product iteration. During scale-up phases, startups qualify for upgrade benefits: • Core modules from pilot equipment can be traded in with value deduction toward production-line machinery • Optional technical collaboration including process development support and experimental data sharing This program has successfully enabled multiple startups to transition smoothly from lab to pilot production while mitigating early-stage investment risks.
  • Can Locsen's equipment handle perovskite solar cells of varying sizes? What is the maximum supported dimension?

    Locsen's laser equipment features exceptional size compatibility, capable of processing perovskite solar cells ranging from 10cm×10cm to 2.4m×1.2m. For oversized cell processing (e.g., 12m×2.4m rigid substrates), we offer customized gantry-type laser systems with multi-laser-head synchronization to ensure both precision and throughput. • Proven Performance: Successfully processed 1.2m×0.6m cells with industry-leading scribing accuracy (±15μm) and uniformity (>98%) • Modular Design: Swappable optical modules adapt to varying thicknesses (0.1-6mm) • Smart Calibration: AI-assisted real-time beam alignment compensates for substrate warpage
  • Does Locsen provide tailored laser solutions for all key production stages of perovskite solar cells?

    Yes, Locsen provides comprehensive laser processing solutions covering the entire perovskite solar cell production chain: P0 Laser Marking: For cell identification post-film deposition P1/P2/P3 Laser Scribing: Precision patterning of • Transparent conductive layers (P1) • Perovskite active layers (P2) • Back electrodes (P3) P4 Edge Isolation: Micron-level edge trimming to prevent short-circuiting Tandem Cell Modules: Dedicated laser etching systems for multi-material layer processing Our integrated equipment ecosystem ensures all laser processing requirements are met with: • ≤20μm alignment accuracy across layers • Thermal Affect Zone controlled under 5μm • Modular platforms supporting R&D to GW-scale production
  • What composition tolerance ranges do Locsen's tools support for variant perovskite formulations?

    Locsen's laser systems demonstrate exceptional adaptability to diverse perovskite compositions. • Preloaded Parameters: Optimized settings for mainstream formulations (e.g., FAPbI₃, CsPbI₃) in the laser recipe library enable instant operator access • R&D Support: For novel compositions (e.g., Sn-based perovskites), our team delivers: Custom wavelength/fluence calibration within 72 hours Performance validation ensuring <1% PCE degradation post-processing • Smart Compensation: On-board spectroscopy modules monitor reflectivity in real-time, automatically adjusting: Pulse duration (20-500ns) Beam profile (Top-hat/Gaussian) Energy density (0.5-3J/cm²) Technical Highlights: ▸ Tolerance for ±15% stoichiometric variation in Pb:Sn ratios ▸ Support for 2D/3D hybrid phase patterning ▸ Non-contact processing avoids cross-contamination

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