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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582
The GLC11-300-300 Glass Laser Cutting And Breaking Machine is a highly integrated precision processing solution developed for high-accuracy glass cutting and controlled breaking applications. The machine combines an infrared picosecond laser cutting module and a CO₂ laser breaking module in one platform, enabling glass cutting and separation to be completed in a continuous workflow. This integrated design reduces handling steps, improves process consistency, and delivers cleaner, more stable cutting results for precision glass applications.
The equipment is designed for glass substrates with a maximum size of 300 × 300 mm and supports material thicknesses of less than 10 mm. It integrates a precision X/Y/Z motion system, a CCD vision alignment module, a dust extraction system, an electrical control system, and independently developed process software. By combining high-speed motion, micron-level positioning, and intelligent control, the machine is suitable for applications requiring fine cutting width, low chipping, and high dimensional accuracy.
In the cutting stage, the infrared picosecond laser follows the preset drawing path to perform high-precision glass cutting. In the breaking stage, the CO₂ laser follows the same path to complete controlled separation. This dual-laser process is especially suitable for precision glass components that require better edge quality and more stable yield than conventional mechanical methods can provide.
The core function of this machine is the integration of two dedicated laser processing systems within one platform. The infrared picosecond laser performs fine cutting, while the CO₂ laser performs controlled breaking along the same programmed path. This process architecture improves both cutting precision and separation consistency.
| Parameter | Infrared Picosecond Laser | CO₂ Laser |
|---|---|---|
| Average Power | ≥60 W | >100 W |
| Central Wavelength | 1064 nm | 10.6 μm |
| Repetition Frequency | 50–500 kHz | <25 kHz |
| Pulse Width | <15 ps | — |
| Energy Stability | <2% rms over 8 hours | <±5% |
| Beam Quality | M² ≤ 1.4 | M² < 1.3 |
| Output Spot Size | 2.5 ± 0.5 mm | 1.8 ± 0.2 mm |
| Service Life | >20,000 h | >20,000 h |
| Cooling Method | Water Cooling | Air Cooling |
This laser combination gives the machine both the fine cutting capability of ultrafast laser processing and the efficient separation performance of CO₂ thermal breaking.
The machine is equipped with a self-developed X-Y-Z multi-axis motion platform. The X and Y axes use linear motor structures for high-speed and high-precision movement, while the Z axis uses a screw-driven focus adjustment mechanism to ensure accurate focal positioning during processing.
| Item | Specification |
|---|---|
| X-Axis Travel | 300 mm |
| Y-Axis Travel | 300 mm |
| Effective Processing Area | 300 × 300 mm |
| X/Y Motion Speed | >500 mm/s |
| X/Y Repeatability | ±2 μm |
| X/Y Positioning Accuracy | ±2 μm |
| Z-Axis Stroke | 50 mm |
| Z-Axis Max Speed | 25 mm/s |
This structure ensures accurate motion control and supports stable processing of straight lines, oblique lines, arcs, and other shaped cutting paths.
The machine uses an off-axis CCD vision system for target capture and precise positioning. The vision module is designed to identify alignment marks automatically, allowing the machine to load the workpiece, recognize positioning references, and start machining with reduced manual adjustment.
| Item | Specification |
|---|---|
| Camera Type | Digital Camera |
| Camera Resolution | 5 MP |
| Optical Magnification | 1.5X |
| Light Source | LED |
| Camera Field Of View | ≥5.3 mm × 4.7 mm |
| Mark Support | Common mark patterns supported |
This visual positioning capability improves alignment accuracy, reduces setup error, and helps maintain process consistency in batch production.
The control software is independently developed by Lecheng Intelligent and is designed to manage the entire machining workflow, from drawing import to path planning, parameter setting, and fault monitoring. It supports DXF file import, online graphic editing, process database management, and multi-layer parameter control.
| Function | Description |
|---|---|
| Integrated Control | Motion platform control and laser on/off control |
| Graphic File Import | Supports DXF format |
| Online Graphic Editing | Built-in editing window |
| Process Expert Database | Parameter editing, saving, and importing |
| Port Monitoring | Real-time status detection |
| Error Diagnosis | Fault code output for troubleshooting |
| Image Recognition | CCD-based closed-loop positioning |
| Layered Processing | Different power, frequency, and speed settings by layer |
| Path Planning | Path optimization based on graphic layers |
This software architecture makes the machine suitable for both standardized production and application-specific process customization.
The machine combines glass cutting and breaking in one unit, reducing intermediate transfer steps and improving process continuity.
The machine is designed for precision glass segmentation and offers strong dimensional and positional control.
| Item | Specification |
|---|---|
| Max Glass Size | 300 × 300 mm |
| Min Compatible Size | 5 × 5 mm |
| Material Type | Glass |
| Thickness Capability | <10 mm |
| Cutting Speed | ≤500 mm/s |
| Breaking Speed | Max 100 mm/s |
| Cutting Width | 5 μm |
| Line Width Accuracy | ≤±5 μm |
| Position Accuracy | ≤±10 μm |
| Dimensional Accuracy | ≤±30 μm |
These figures make the machine suitable for applications where edge quality and process repeatability are critical.
Glass edge quality is an important factor in downstream assembly and product yield. This machine is designed to keep edge chipping within 50–80 μm, and the specified yield reaches 99% when chipping remains below 100 μm.
For industrial users, long-term stability is just as important as cutting precision.
| Item | Specification |
|---|---|
| Yield | 99% |
| Utilization Rate | 99% |
| Average Maintenance Time | ≤1 hour |
| Mean Time Between Failures | ≥200 hours |
This makes the machine suitable for continuous production scenarios requiring both uptime and consistent quality.
The equipment integrates six functional modules: infrared cutting module, CO₂ breaking module, motion system, dust extraction system, vision system, and software system. The machine structure combines a welded steel frame with a granite base for better rigidity and motion stability.
The Glass Laser Cutting And Breaking Machine is suitable for:
Precision glass cutting and controlled breaking
Glass substrate segmentation for advanced manufacturing
Small and medium-sized glass component processing
Functional glass parts with strict dimensional tolerance requirements
Straight-line, oblique-line, and arc-shape cutting applications
Precision industrial glass processing for photovoltaic, electronics, and related sectors
Its combination of picosecond cutting precision, CO₂ breaking efficiency, vision-assisted positioning, and automated control makes it especially suitable for manufacturers looking for a more accurate and cleaner alternative to conventional glass separation methods.
| Category | Specification |
|---|---|
| Model | GLC11-300-300 |
| Product Name | Glass Laser Cutting And Breaking Machine |
| Compatible Glass Size | Up to 300 × 300 mm |
| Minimum Size | 5 × 5 mm |
| Glass Thickness | <10 mm |
| Laser 1 | 60W Infrared Picosecond |
| Laser 2 | >100W CO₂ |
| Motion System | X/Y/Z multi-axis platform |
| Vision System | 5 MP CCD camera |
| Cutting Speed | ≤500 mm/s |
| Breaking Speed | Max 100 mm/s |
| Cutting Width | 5 μm |
| Position Accuracy | ≤±10 μm |
| Dimensional Accuracy | ≤±30 μm |
| Equipment Size | 1500 × 1500 × 1800 mm |
| Rated Power | 6 kW |
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80px
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582