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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582The FCC-05 Series Laser Integrated Processing System is a cutting-edge dual-optical-path platform designed for R&D and production of thin-film solar cells. Its core components include:
Dual-Laser Configuration: Integrates a fiber nanosecond laser and ultrafast pulsed laser (wavelength options: 1064nm/532nm/355nm) for versatile processing.
Precision Mechanics: Offers a 500mm×500mm(max) processing area with <30μm feature resolution and ±5μm positioning accuracy, enabled by multi-mode positioning technology.
Modular Integration: Combines an automated control system, high-speed optical processing unit, and machine vision alignment system in a compact, stable frame.
Proprietary Software: Features self-developed control software with intuitive HMI for customizable process workflows.
Key innovations include the simultaneous P1/P2/P3 laser scribing and P4 edge isolation capability, achieved through synchronized dual-beam processing—a critical advantage for thin-film solar cell manufacturing.

Unmatched Stability:
Advanced motion control hardware (e.g., linear encoders, vibration-damped stages) ensures 24/7 operational reliability even in high-throughput environments.
Seamless subsystem integration minimizes downtime.
Process Flexibility:
Wavelength-switching capability (IR/visible/UV) adapts to diverse thin-film materials (CIGS, CdTe, perovskite).
Programmable parameters (pulse width, energy, overlap) via proprietary software enable R&D-grade tunability.
Precision Engineering:
Multi-sensor feedback (CCD alignment, laser interferometry) guarantees sub-5μm repeatability for critical scribing tasks.
Dynamic focus control maintains consistency across uneven substrates.
Future-Ready Design:
Supports AI-driven process optimization and IoT connectivity for Industry 4.0 integration.
Primarily deployed for:
Thin-Film Solar Cell R&D: Accelerates process development for small-format solar modules, including:
P1-P4 patterning (transparent conductive oxide, absorber, back-contact layers).
Edge isolation with minimized thermal damage (<50μm heat-affected zone).
Pilot Production: Serves as a bridge between lab-scale and mass production, offering:
Process validation for new materials (e.g., perovskite tandem cells).
High-yield prototyping (up to 98% scribing accuracy).
Quality Control:
In-line defect detection via integrated imaging systems.
Non-contact processing eliminates mechanical stress on fragile substrates.
Industry Impact: This system addresses key challenges in thin-film solar manufacturing—throughput bottlenecks, layer alignment errors, and edge recombination losses—while reducing production costs by up to 20% compared to conventional multi-step systems.
Ultrafast laser scribing enhances solar cell production efficiency. Non-contact processing prevents silicon wafer micro-cracks. Automated alignment ensures ±5μm precision for all cell types.
MorePrecision Scribing: Achieve sub-micron accuracy for flawless thin-film patterning. High-Speed R2R Processing: Maximize throughput with continuous roll-to-roll automation. Non-Contact Edge Clearing: Eliminate micro-cracks & contamination, ensure clean edges. Versatile Material Handling: Process ITO, PET, PI, copper & more with ease.
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582