Here is the professional English translation of the provided text about Lecheng Intelligence Technology (Suzhou) Co., Ltd., with accurate technical terminology:
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Established in 2022, Lecheng Intelligence Technology (Suzhou) Co., Ltd. is strategically located in the vibrant industrial hub of Changshu Economic Development Zone. As a technology-driven enterprise specializing in laser processing equipment for the new energy sector, the company has embedded "technological innovation" into its core DNA since its inception. Committed to advancing the upgrade of the new energy industry, Lecheng continuously refines its expertise across the entire value chain—R&D, production, and after-sales service—for laser and automation equipment used in perovskite solar cells (PSCs). The company also provides complete perovskite solar cell production line solutions, establishing a prominent position within the industry through its professional capabilities.
In the new energy field, Lecheng consistently focuses on high-value, cutting-edge applications. The company has assembled an R&D team comprising experts in laser technology, automation control, material science, and other disciplines. This team conducts pioneering R&D on laser processing techniques for various new energy materials. Rooted in the laboratory, they meticulously explore the intricate interactions between lasers and materials through countless experiments. By keenly identifying industry technical pain points and market demand shifts, Lecheng promptly develops tailored solutions, continuously injecting momentum into China's energy revolution.
To date, the company has successfully developed and commercialized a 150MW-level perovskite solar cell laser processing production line. This line's performance metrics all meet domestically advanced levels, marking a significant milestone for Lecheng in the PSC laser processing equipment domain. Concurrently, aligning with the trend toward large-scale development in the new energy industry, Lecheng has initiated R&D for GW-level battery production lines, dedicated to providing the industry with more efficient and stable mass-production solutions.
Regarding product deliveries, Lecheng has successfully supplied laser equipment for customer 100MW-level PSC pilot lines. Deliveries include:
One P0 laser marking device
One P1 laser scribing device
One P2 laser scribing device
One P3 laser scribing device
One P4 edge isolation/cleaning (laser scribing) device
These successful deliveries not only validate Lecheng's technical strength but also provide critical support for the smooth operation of customer pilot lines.
Laser Scribing Equipment, a core Lecheng product, features a sophisticated structure and powerful capabilities. It primarily consists of three integrated sections:
Loading Station: Automates panel loading.
Laser Scribing Host Machine: The core processing unit.
Unloading Station: Automates processed panel unloading.
The loading and unloading stations function seamlessly as coordinated automation units, eliminating manual intervention. This boosts production efficiency while minimizing potential human error and contamination risks. The Laser Scribing Host Machine, the system's core, handles the critical P1, P2, and P3 laser scribing tasks. Its complex and precise interior integrates key components:
Granite Base Plate: Ensures exceptional rigidity and stability, minimizing vibration impact on scribing precision.
Linear Motion Modules: Drive components for high-precision linear movement, guaranteeing scribe location accuracy.
Cell Handling and Clamping Module: A precise robotic arm system for stable, accurate cell positioning and secure fixation.
Ultrafast Laser Source: The processing "powerhouse," delivering high-energy, ultrashort laser pulses for high-precision material ablation.
Laser Beam Splitting and Shaping Module: Optimally splits and reshapes the laser beam for scribing requirements.
Laser Focusing Module: Precisely focuses the laser beam onto the cell surface to form a micro processing spot.
Vision and Inspection Systems: Act as the system's "eyes," enabling real-time scribing process monitoring and quality control.
A key innovation is the capability for simultaneous TWELVEBEAM™ laser scribing. This Multi-Beam Processing technology significantly increases perovskite cell laser scribing throughput, providing robust support for mass production.
To further enhance performance, Lecheng integrates several proprietary core technologies into its laser scribing systems:
Laser Beam Shaping Technology: Optimizes laser beam energy distribution and spot shape, ensuring uniform and stable processing results on the cell.
Scribing Path Tracking Technology: Real-time compensation for any minute cell position deviations during handling, maintaining scribe path accuracy.
Laser Focus Following Technology: Maintains precise laser beam focus on the cell surface, adapting to inherent variations in substrate flatness/thickness.
These technologies dramatically improve scribing stability and consistency, effectively reducing the line width (L/W) and pitch (P1/P2/P3) dead zone widths to below 200μm. This breakthrough significantly increases the active area of the perovskite cell, thereby boosting cell power conversion efficiency (PCE), making a vital contribution to PSC performance optimization.
Lecheng's Edge Isolation/Cleaning (Laser Scribing - P4) Device also delivers outstanding performance. Equipped with a high-power fiber laser source, it provides robust energy for edge isolation. Utilizing Lecheng's proprietary Beam Shaping Technology, the laser beam is transformed into a top-hat beam profile for edge isolation. This profile ensures uniform edge removal, eliminating the risk of over- or under-processing associated with traditional Gaussian beams. Coupled with a high-speed galvanometer scanner, the device achieves exceptional cleaning/scribing speed, enabling rapid, precise completion of the edge isolation process.
Furthermore, Lecheng optimizes the laser edge isolation procedure to effectively prevent issues like edge curling near the cell's active area and interdiffusion/melting between the top and bottom electrodes (P1/P3 shorts). This optimization fundamentally reduces the probability of defects originating at the cell edges, significantly improving production yield. This enhancement boosts product quality while lowering manufacturing costs, delivering substantial added value to customers.
Leveraging advanced technology, precision equipment, and high-quality service, Lecheng Intelligence Technology (Suzhou) Co., Ltd. has achieved remarkable success in the perovskite solar cell laser processing equipment sector. The company remains steadfast in its technology-driven ethos, continuously increasing R&D investment to introduce higher-performance equipment and solutions, committed to contributing to the advancement of China's new energy industry.
Comprehensive Technical Solutions for the Entire Field of Laser Precision Machining：
1. Laser Precision Marking
Full-material compatibility: Permanently marks metals, plastics, ceramics, glass, and more with micron-level precision
Advanced identifiers: Supports QR codes, serial numbers, and complex graphics engraving for traceability
Critical applications: Widely used in high-end traceability fields including electronic components, medical devices, and aerospace
2. Ultra-thin Glass Laser Precision Cutting
Breakthrough technology: Enables fragment-free cutting of 0.1–2mm ultra-thin glass, overcoming traditional limitations
Edge strength innovation: Proprietary thermal stress control boosts edge strength by 300%
Revolutionary solutions: Core technology for foldable displays, automotive screens, and photovoltaic substrates
3. High-Stability Laser Welding Systems
Dissimilar material expertise: Solves welding challenges for copper-aluminum alloys with ±5μm thermal deformation control
Customized key processes: Develops hermetic sealing for EV batteries and gas-tight welding for sensors
Industry-leading yield: Achieves **>99.8% welding yield** to enhance smart manufacturing efficiency
4. Micro-nano Laser Etching Equipment
Ultra-fine capabilities: Minimum line width of 5μm, supporting curved-surface super-fine patterning
High-end applications: Critical for semiconductor lead frames, PERC solar cells, and precision mold texturing
Technology driver: Accelerates R&D in flexible circuits and next-gen microelectronics
5. Laser Precision Cutting
(1) Metal Cutting
Accuracy: ≤10μm for metals (steel, aluminum, tungsten) under 2mm thickness.
Thermal control: Heat Affected Zone (HAZ) <30μm.
Applications: Medical implants, precision instruments
(2) PCB/FPC Circuit Board Cutting
Precision: ≤10μm accuracy with HAZ <30μm.
Technology: High-speed galvanometer scanners for efficiency
(3) Glass Cutting
Thickness range: 0.05–10mm; edge chipping <30μm.
Key uses: Display panels, photovoltaic substrates, hermetic glass lids
