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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
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+86-177511735821. Multi-channel architecture enables parallel IV and MPPT testing. 2. Independent channel control ensures high-precision data acquisition. 3. Built-in MPPT algorithms handle perovskite hysteresis effectively. 4. Automated software supports long-term, unattended stability testing.
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1. Optical shaping delivers true parallel light with <5° collimation. 2. Class A+ spectrum ensures accurate perovskite response testing. 3. Large 300×300 mm uniform area supports device and module research. 4. Dual steady and pulse modes enable efficiency and stability tests.
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1. Integrated AM0 light, thermal stage, and testing system in one cabinet. 2. Class A AM0 spectrum with extreme temperature simulation from -180°C to +150°C. 3. Multi-channel IV and MPPT testing enables high-throughput space PV evaluation. 4. Automated software supports 24/7 unattended stability and aging tests.
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Precision Scribing: Achieve sub-micron accuracy for flawless thin-film patterning. High-Speed R2R Processing: Maximize throughput with continuous roll-to-roll automation. Non-Contact Edge Clearing: Eliminate micro-cracks & contamination, ensure clean edges. Versatile Material Handling: Process ITO, PET, PI, copper & more with ease.
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Ultrafine 5μm Laser Etching—Sub-micron precision for semiconductors & FPCs. 2000mm/s High-Speed Processing—4x faster vs chemical etching, zero waste. 200+ Material Compatibility—From glass to titanium alloys, non-contact. Intelligent HMI Control—Auto-focus & CAD integration, ISO certified.
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Fully enclosed design for safe, dust-free operation. High-power laser for fast rust & coating removal. Automated controls for precision cleaning results. Low maintenance, ideal for industrial applications.
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Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
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Cold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.
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Five-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.
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Integrated laser scoring/breaking eliminates secondary processing. CO₂ laser creates smooth edges without micro-cracks. Patented force control ensures consistent 100μm accuracy.
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582