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Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Address

J Building, Sound Valley Innovation Accelerator Center, Changshu Economic Development Zone, Changshu City, Jiangsu Province, China

Address

Email

jack@le-laser.com

Phone

+86-17751173582

Fax

  • HDI Microvia Drilling Equipment
  • HDI Microvia Drilling Equipment
  • HDI Microvia Drilling Equipment
  • HDI Microvia Drilling Equipment
  • video

HDI Microvia Drilling Equipment

Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
  • Le Cheng
  • Shanghai
  • Three months
  • Fifty sets within the year
Tags:
HDI Microvia Drilling Equipment​​Laser PCB Drilling System​​​High-Density Interconnect Driller​Precision Micro-hole Drilling Equipment​PCB Laser Via Machine​

HDI Microvia Drilling Equipment Description

The HDI Microvia Drilling Equipment is a high-precision laser processing system specifically designed for high-density interconnect (HDI) boards. Featuring advanced UV laser technology combined with precision positioning stages and intelligent control systems, it achieves microvia drilling as small as 25μm, making it ideal for 5G communication devices and premium smartphone motherboards.

HDI Microvia Drilling Equipment

​​Laser PCB Drilling System​

​​High-Density Interconnect Driller​

System Features

  1. Laser System:

    • 355nm UV nanosecond/picosecond laser

    • Beam quality M²<1.3, adjustable spot size (10-50μm)

    • ±2% pulse energy stability

  2. Motion System:

    • High-precision linear motor stages

    • ±5μm positioning accuracy, ±2μm repeatability

    • Maximum acceleration of 2m/s²

  3. Vision System:

    • 10MP high-resolution CCD camera

    • ±2μm auto-focus accuracy

    • PCB expansion compensation

  4. Control System:

    • Industrial-grade motion controller

    • Direct Gerber file import

    • Automatic path optimization

Technical Advantages

Specification

Parameter

Benefit

Minimum Via Size

25μm

Meets ultra-HDI requirements

Position Accuracy

±5μm

Ensures layer-to-layer alignment

Processing Speed

500 holes/sec

High production throughput

Via Wall Quality

Ra<1μm

Reduces plating difficulty

Equipment Uptime

>95%

Guarantees production stability

HDI Microvia Drilling Equipment



Key Advantages:

  • Non-contact processing eliminates mechanical stress

  • Automatic material expansion compensation

  • Intelligent energy control for consistent via shape

  • Modular design for easy maintenance

Typical Applications

  1. Communication Equipment:

    • 5G base station PCBs

    • Millimeter-wave antenna boards

  2. Consumer Electronics:

    • Smartphone motherboards

    • Wearable device flex boards

  3. Automotive Electronics:

    • Vehicle radar PCBs

    • New energy vehicle control modules

  4. Aerospace/Military:

    • High-reliability military PCBs

    • Satellite communication boards

Specifications are indicative only - All equipment is fully customizable to your needs！

  • How long does it take from equipment ordering to official production when cooperating with Locsen?

    The overall timeline varies depending on equipment specifications and production line scale. For standalone equipment, standard models require a 45-day manufacturing cycle, with total duration (including shipping and installation) of approximately 60 days. Customized equipment requires an additional 30 days based on technical requirements. For complete line solutions: • 100MW-level production lines require ~4 months for planning, equipment manufacturing, installation, and commissioning • GW-level production lines require ~8 months We provide detailed project schedules with dedicated managers ensuring seamless coordination. Example: A client's 1GW perovskite production line was completed 15 days ahead of schedule through parallel equipment manufacturing and facility construction.

  • Does Locsen offer suitable equipment and partnership solutions for startup perovskite companies

    Locsen offers a "Phased Partnership Program" specifically designed for perovskite startups. For the initial R&D phase, we provide compact pilot-scale equipment (e.g., 10MW laser scribing systems) bundled with essential process packages to facilitate technology validation and product iteration. During scale-up phases, startups qualify for upgrade benefits: • Core modules from pilot equipment can be traded in with value deduction toward production-line machinery • Optional technical collaboration including process development support and experimental data sharing This program has successfully enabled multiple startups to transition smoothly from lab to pilot production while mitigating early-stage investment risks.

  • Can Locsen's equipment handle perovskite solar cells of varying sizes? What is the maximum supported dimension?

    Locsen's laser equipment features exceptional size compatibility, capable of processing perovskite solar cells ranging from 10cm×10cm to 2.4m×1.2m. For oversized cell processing (e.g., 12m×2.4m rigid substrates), we offer customized gantry-type laser systems with multi-laser-head synchronization to ensure both precision and throughput. • Proven Performance: Successfully processed 1.2m×0.6m cells with industry-leading scribing accuracy (±15μm) and uniformity (＞98%) • Modular Design: Swappable optical modules adapt to varying thicknesses (0.1-6mm) • Smart Calibration: AI-assisted real-time beam alignment compensates for substrate warpage

  • Does Locsen provide tailored laser solutions for all key production stages of perovskite solar cells?

    Yes, Locsen provides comprehensive laser processing solutions covering the entire perovskite solar cell production chain: P0 Laser Marking: For cell identification post-film deposition P1/P2/P3 Laser Scribing: Precision patterning of • Transparent conductive layers (P1) • Perovskite active layers (P2) • Back electrodes (P3) P4 Edge Isolation: Micron-level edge trimming to prevent short-circuiting Tandem Cell Modules: Dedicated laser etching systems for multi-material layer processing Our integrated equipment ecosystem ensures all laser processing requirements are met with: • ≤20μm alignment accuracy across layers • Thermal Affect Zone controlled under 5μm • Modular platforms supporting R&D to GW-scale production

  • What composition tolerance ranges do Locsen's tools support for variant perovskite formulations?

    Locsen's laser systems demonstrate exceptional adaptability to diverse perovskite compositions. • Preloaded Parameters: Optimized settings for mainstream formulations (e.g., FAPbI₃, CsPbI₃) in the laser recipe library enable instant operator access • R&D Support: For novel compositions (e.g., Sn-based perovskites), our team delivers: Custom wavelength/fluence calibration within 72 hours Performance validation ensuring <1% PCE degradation post-processing • Smart Compensation: On-board spectroscopy modules monitor reflectivity in real-time, automatically adjusting: Pulse duration (20-500ns) Beam profile (Top-hat/Gaussian) Energy density (0.5-3J/cm²) Technical Highlights: ▸ Tolerance for ±15% stoichiometric variation in Pb:Sn ratios ▸ Support for 2D/3D hybrid phase patterning ▸ Non-contact processing avoids cross-contamination

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Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Address

J Building, Sound Valley Innovation Accelerator Center, Changshu Economic Development Zone, Changshu City, Jiangsu Province, China

WhatsApp

8618795479605

Email

jack@le-laser.com

Phone

+86-17751173582

Fax

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J Building, Sound Valley Innovation Accelerator Center, Changshu Economic Development Zone, Changshu City, Jiangsu Province, China jack@le-laser.com +86-17751173582