HDI Microvia Laser Drilling Equipment for PCB Manufacturing

HDI Microvia Drilling Equipment Description

The HDI Microvia Drilling Equipment is a high-precision laser processing system specifically designed for high-density interconnect (HDI) boards. Featuring advanced UV laser technology combined with precision positioning stages and intelligent control systems, it achieves microvia drilling as small as 25μm, making it ideal for 5G communication devices and premium smartphone motherboards.

System Features of HDI Microvia Drilling Equipment

1. Laser System:

• 355nm UV nanosecond/picosecond laser

• Beam quality M²<1.3, adjustable spot size (10-50μm)

• ±2% pulse energy stability

2. Motion System:

• High-precision linear motor stages

• ±5μm positioning accuracy, ±2μm repeatability

• Maximum acceleration of 2m/s²

3. Vision System:

• 10MP high-resolution CCD camera

• ±2μm auto-focus accuracy

• PCB expansion compensation

4. Control System:

• Industrial-grade motion controller

• Direct Gerber file import

• Automatic path optimization

Technical Advantages of HDI Microvia Drilling Equipment

Key Advantages:

• Non-contact processing eliminates mechanical stress

• Automatic material expansion compensation

• Intelligent energy control for consistent via shape

• Modular design for easy maintenance

Typical Applications of HDI Microvia Drilling Equipment

1. Communication Equipment:

• 5G base station PCBs

• Millimeter-wave antenna boards

2. Consumer Electronics:

• Smartphone motherboards

• Wearable device flex boards

3. Automotive Electronics:

• Vehicle radar PCBs

• New energy vehicle control modules

4. Aerospace/Military:

• High-reliability military PCBs

• Satellite communication boards

Specifications are indicative only - All equipment is fully customizable to your needs！