Laser Cutting Equipment

Dual-laser design enables cutting and breaking in one pass. Picosecond processing ensures clean edges with no cracks. High precision motion system delivers micron-level accuracy. Stable performance supports continuous industrial production.

Picosecond cutting and CO2 breaking in one machine. High precision motion system ensures fine glass processing. CCD vision alignment improves positioning and yield. Designed for 300×300 mm glass with stable automation.

Ultrafine 5μm Laser Etching—Sub-micron precision for semiconductors & FPCs. 2000mm/s High-Speed Processing—4x faster vs chemical etching, zero waste. 200+ Material Compatibility—From glass to titanium alloys, non-contact. Intelligent HMI Control—Auto-focus & CAD integration, ISO certified.

Cold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.

Five-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.

Nanometer precision​​ for flawless micro-scale machining. ​​Ultrafast lasers​​ enable clean, burr-free cuts. ​​Multi-material compatibility​​ for versatile applications. ​​Automated focus control​​ ensures consistent high quality.

Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.

P-Series delivers industry-leading 120m/min cutting speed. Six-axis CNC control enables complex 3D pipe profiles. Automatic loading/unloading boosts production efficiency. Maintains ±0.1mm precision across all pipe diameters.

Ultra-precise laser cutting for flexible OLED panels. Non-contact process prevents display layer damage. Automated alignment ensures micron-level cutting accuracy. Compact design fits cleanroom production environments.

​​Non-contact laser cutting for zero material loss.​​ High-precision slicing for superior wafer quality.​​ Automated operation boosts production efficiency.​​ Low thermal impact preserves SiC properties.​