Laser Cutting Equipment

Cold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.

Space-Saving Design: Compact benchtop unit fits any workshop or office. Precision Metal Cutting: Cuts steel, aluminum, copper with razor-sharp detail. Plug-&-Play Operation: User-friendly software, minimal training required. Industrial Performance: Professional results without industrial space needs.

Silicon carbide ingot laser slicing system provides non contact cutting for SiC wafer preparation. High precision laser processing helps reduce material loss and improve slicing consistency. Suitable for semiconductor materials advanced wafer processing and SiC production applications.

Laser high precision micro machining equipment supports burr free drilling cutting and fine feature processing. Ultrafast laser control helps achieve clean edges nanometer level precision and stable repeatability. Suitable for electronics glass ceramics semiconductor parts and precision material processing.