Laser High Precision Micro Machining Equipment

Structural Features

Our laser precision micro-machining system features a modular design integrating an ultrafast laser source (picosecond/femtosecond), high-precision motion control, real-time vision alignment, and intelligent thermal management for stable long-term operation. Key components include:

• Granite/aerospace aluminum base minimizes vibration, ensuring ±1μm accuracy.

• 5-axis CNC system enables complex 3D surface machining.

• Fully enclosed safety chamber with auto-dust extraction and gas purification, compliant with CE/ISO Class 4 laser safety standards.

Technical Advantages

• Ultra-short pulse laser (<10ps): Near-zero heat-affected zone (HAZ), ideal for brittle materials (glass, ceramics) and thin films.

• Adaptive beam shaping: Dynamically adjusts spot size (5-50μm) and energy distribution for multi-material compatibility.

• AI-powered real-time QC: High-resolution CCD and deep learning algorithms detect defects and auto-correct machining paths.

• Energy-efficient: 30% lower power consumption vs. conventional methods, suitable for 24/7 production.

Typical Applications

• Electronics: FPC circuit cutting, IC chip marking, 5G antenna LDS structuring.

• Medical devices: Cardiovascular stent engraving, contact lens mold micro-drilling.

• Optics: AR/VR diffraction waveguide fabrication, sapphire camera lens cutting.

• Research: Metamaterial surface microstructuring, MEMS sensor processing.

Specifications are indicative only - All equipment is fully customizable to your needs！