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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.
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Laser high precision micro machining equipment supports burr free drilling cutting and fine feature processing. Ultrafast laser control helps achieve clean edges nanometer level precision and stable repeatability. Suitable for electronics glass ceramics semiconductor parts and precision material processing.
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40px
80px
80px
80px
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582