• 30
    Countries Served
  • 24/7
    Technical Support
  • 200
    Employee Count
  • 2022
    Founding Time

Comprehensive Technical Solutions for the Entire Field of Laser Precision Machining:

1. Laser Precision Marking

  • Full-material compatibility: Permanently marks metals, plastics, ceramics, glass, and more with micron-level precision

  • Advanced identifiers: Supports QR codes, serial numbers, and complex graphics engraving for traceability

  • Critical applications: Widely used in high-end traceability fields including electronic components, medical devices, and aerospace


2. Ultra-thin Glass Laser Precision Cutting

  • Breakthrough technology: Enables fragment-free cutting of 0.1–2mm ultra-thin glass, overcoming traditional limitations

  • Edge strength innovation: Proprietary thermal stress control boosts edge strength by 300%

  • Revolutionary solutions: Core technology for foldable displays, automotive screens, and photovoltaic substrates

3. High-Stability Laser Welding Systems

  • Dissimilar material expertise: Solves welding challenges for copper-aluminum alloys with ±5μm thermal deformation control

  • Customized key processes: Develops hermetic sealing for EV batteries and gas-tight welding for sensors

  • Industry-leading yield: Achieves **>99.8% welding yield** to enhance smart manufacturing efficiency


4. Micro-nano Laser Etching Equipment

  • Ultra-fine capabilities: Minimum line width of 5μm, supporting curved-surface super-fine patterning

  • High-end applications: Critical for semiconductor lead frames, PERC solar cells, and precision mold texturing

  • Technology driver: Accelerates R&D in flexible circuits and next-gen microelectronics


5. Laser Precision Cutting

(1) Metal Cutting

  • Accuracy: ≤10μm for metals (steel, aluminum, tungsten) under 2mm thickness.

  • Thermal control: Heat Affected Zone (HAZ) <30μm.

  • Applications: Medical implants, precision instruments

(2) PCB/FPC Circuit Board Cutting

  • Precision: ≤10μm accuracy with HAZ <30μm.

  • Technology: High-speed galvanometer scanners for efficiency

(3) Glass Cutting

  • Thickness range: 0.05–10mm; edge chipping <30μm.

  • Key uses: Display panels, photovoltaic substrates, hermetic glass lids 


Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Lecheng Intelligence Technology (Suzhou) Co., Ltd. is strategically located in the vibrant industrial hub of Changshu Economic Development Zone. As a technology-driven enterprise specializing in laser processing equipment for the new energy sector, the company has embedded "technological innovation" into its core DNA since its inception. Committed to advancing the upgrade of the new energy industry, Lecheng continuously refines its expertise across the entire value chain—R&D, production, and after-sales service—for laser and automation equipment used in perovskite solar cells (PSCs). The company also provides complete perovskite solar cell production line solutions, establishing a prominent position within the industry through its professional capabilities.
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Featured products

Product advantages

  • Perovskite laser production line

    Lecheng Intelligent is a leading expert in perovskite solar cell laser processing equipment. Specializing in high-precision laser scribing and edge deletion machines for perovskite PV production, their product lineup includes P1, P2, P3 laser scribing equipment and P4 edge isolation devices. Their systems feature real-time focus tracking, vision compensation, and multi-beam scribing capabilities, supporting up to 150MW production lines and enabling high efficiency with minimized dead zones for large-area perovskite modules.



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  • Laser Scribing Machine

    Laser scribing machine utilizes high-energy laser beams to create precise micro-cuts or grooves on materials such as silicon wafers, thin-film solar cells, ceramics, and metals (≤0.5 mm thickness). This non-contact process achieves micron-level accuracy (kerf width: 0.01–0.05 mm) through controlled ablation, enabling electrical isolation or segmentation in photovoltaic cells and semiconductor devices. Key components  include:

    • Laser Source: Fiber (1064 nm), UV (355 nm), or CO₂ (10.6 µm) lasers, selected for material compatibility and precision requirements.

    • Galvanometer Scanning System: High-speed mirrors (≤8,000 mm/s) for beam positioning with ±0.001 mm repeatability.

    • CNC Worktable: Automated vacuum adsorption platform for stable material handling.

    • Cooling System: Air or water cooling (precision: ±0.5°C) to maintain thermal stability.

    • Software: Compatible with CAD/CAM tools (e.g., AutoCAD, CorelDraw) for path programming and real-time monitoring. 


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  • Laser Edge Isolation Equipment

    Laser Edge Cleaning Equipment-This system utilizes laser etching technology to perform the P4 edge cleaning process. It not only enables fixed-width edge scanning along all four sides of the substrate but also supports customized edge patterning in other specified areas based on unique product design requirements.

    Key Features:

    • P4 Process Compatibility: Precision laser etching for edge isolation.

    • Flexible Processing: Handles both standard peripheral scanning and customized patterns.

    • Substrate Adaptability: Suitable for diverse materials and design specifications.


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  • Laser Marking Equipment

    Le Cheng provides high-performance laser marking equipment including fiber laser markers, CO2 engravers, and UV laser systems for metals, plastics, and electronics. Our CE-certified machines deliver permanent, high-speed marking with low maintenance. Ideal for automotive, aerospace, and medical industries. Free quote available!

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  • Laser engraving machine

    A laser engraving machine is an advanced technological device that utilizes a focused laser beam to create permanent marks, patterns, or designs on various materials through a process of melting, vaporizing, or inducing chemical changes on the surface. Operating similarly to a computer printer, it translates digital designs from software into precise physical engravings. These machines are highly versatile and can process a wide range of materials, including metals (e.g., stainless steel, aluminum), non-metals (e.g., wood, acrylic, glass, leather), plastics, and ceramics. They are valued for their high precision (up to 1000 DPI resolution), speed (e.g., engraving speeds up to 1000mm/s), and efficiency, enabling detailed and complex designs without physical contact, which eliminates tool wear and reduces material damage.

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  • Laser Integrated Processing

    Utilizing dual or triple optical path designs, this system is primarily used for the development and testing of laser processes on small-format thin-film solar cells. It enables simultaneous execution of laser scribing (P1, P2, P3) and edge isolation (P4) processes for thin-film solar cells.

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  • Laser Cutting Equipment

    Laser cutting equipment utilizes a high-powered, focused laser beam to precisely cut, melt, or vaporize materials like metals, plastics, and wood. Guided by CNC systems, it offers exceptional accuracy, speed, and clean edges for various industrial applications.

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  • Laser Welding Equipment

    A Laser Welding Machine is an advanced device that utilizes a highly concentrated laser beam to join metals or thermoplastics. It operates by focusing the laser onto the material, generating intense heat that melts and fuses the parts together, resulting in a strong, precise weld.

    This technology is renowned for its superior precision, minimal heat distortion, and high welding speeds compared to traditional methods. It produces clean, spatter-free welds with a small heat-affected zone, often eliminating the need for post-processing.

    Laser welding is highly versatile and easily automated, making it indispensable in modern industries such as automotive (e.g., body components, batteries), aerospace, electronics (e.g., circuit boards, sensors), medical device manufacturing, and even jewelry making.



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  • Photovoltaic Solar Testing Equipment

    Photovoltaic Solar Testing Equipment

    Our advanced photovoltaic solar testing equipment is designed to ensure the quality, performance, and safety of solar energy systems. These professional testing instruments provide comprehensive evaluation of PV modules, including EL (Electroluminescent) testing, IV curve analysis, and steady-state performance measurement.
    With user-friendly interfaces and robust data management capabilities, our testing solutions help optimize system design, improve energy conversion efficiency, and extend the operational lifespan of photovoltaic installations.


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Company Profile

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Products

  • Demystifying Beam Splitting Technologies in Perovskite Photovoltaic Laser Processing
    Demystifying Beam Splitting Technologies in Perovskite Photovoltaic Laser Processing
    The transition to gigawatt-scale perovskite solar production hinges on precision laser processing, where beam splitting technology plays a pivotal role. By dividing a single laser source into multiple beams, this technique enables simultaneous scribing of P1-P3 patterns and edge isolation (P4), directly impacting throughput, dead zone control, and production costs. Current industrial approaches primarily include mechanical beam splitting and diffractive optical elements (DOEs), each with distinct advantages for perovskite’s thermal sensitivity and scalability requirements.
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  • The Application of Laser Technology in the Industrialization of Perovskite Solar Cells
    The Application of Laser Technology in the Industrialization of Perovskite Solar Cells
    Perovskite solar cells (PSCs) represent the third generation of thin-film solar technology, renowned for their high efficiency, low cost, and flexibility. As industrialization progresses, laser technology has emerged as a critical enabler, addressing key challenges in precision processing and scalability. This article explores the multifaceted role of lasers in PSC manufacturing.
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  • Roll-to-Roll (R2R) Laser Scribing System for Thin-Film Solar Cells
    Roll-to-Roll (R2R) Laser Scribing System for Thin-Film Solar Cells
    The equipment utilizes a high-energy-density laser beam, precisely controlled by a computer system, to process roll-to-roll thin-film solar cell materials according to pre-programmed scribing patterns. Through laser thermal or cold processing effects, the thin-film material is instantaneously vaporized, separated, or modified, achieving precise scribing to either segment the cells or create specific circuit patterns on them.
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  • Perovskite Photovoltaic Module
    Perovskite Photovoltaic Module
    Lecheng's laser scribing equipment, equipped with a high-precision laser control system, achieves micron-level patterning accuracy with smooth, thermally damage-free edges. This significantly reduces internal resistance losses in solar cells, pushing power conversion efficiency to industry-leading levels—perfectly meeting the high-power output demands of mass production.
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  • High-Precision Laser Micromachining Equipment
    High-Precision Laser Micromachining Equipment
    Laser high-precision micromachining technology achieves material processing through precise control of core parameters such as wavelength, pulse width, and energy density, utilizing either thermal or cold processing mechanisms. This induces instantaneous material vaporization, melting, or modification, enabling operations such as cutting, drilling, engraving, and surface treatment. It stands as a pivotal technology in high-precision manufacturing.
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  • Customer Acclaim
    Customer Acclaim
    This prestigious accolade has significantly elevated Lecheng Intelligent's industry visibility and reputation, distinguishing it as a trusted leader among suppliers. The recognition solidifies its competitive edge and lays a robust foundation for market expansion.
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