Lecheng's picosecond laser systems utilize ultra-short pulse durations (10⁻¹² seconds) to achieve cold ablation processing, where material removal occurs through direct vaporization rather than thermal melting. This technology enables chipping-free cutting of display glass ranging from 0.05mm to 10mm thickness, with edge micro-cracks controlled below 10μm. The picosecond laser's extremely high peak power (up to 100kW) creates precise plasma bursts that cleanly separate glass molecules without transferring heat to surrounding areas. For foldable display applications, this process maintains the intrinsic strength of ultra-thin glass (0.1mm), allowing bending radii under 3mm without structural failure. Lecheng's systems achieve cutting speeds of 500mm/s while maintaining positional accuracy of ±5μm, making them ideal for mass production of smartphone cover glass and automotive displays.
Advanced Beam Control and Adaptive Optics
The equipment incorporates high-precision galvanometer scanners and dynamic focus control systems to maintain consistent beam quality across large-format glass substrates up to 1200×600mm. Lecheng's proprietary beam shaping optics transform the raw laser output into a uniform top-hat profile, eliminating energy fluctuations that cause micro-fractures. For curved or laminated glass, real-time height sensors automatically adjust focal positions with 1μm resolution, ensuring perpendicular sidewalls even on warped surfaces. The system's non-contact processing prevents mechanical stress, achieving edge strength improvements up to 300% compared to mechanical cutting methods. This capability is critical for next-generation displays requiring complex shapes with tight tolerances, such as waterfall screens and under-panel camera cutouts.
Integrated Automation and Quality Assurance
Lecheng's fully automated production lines combine laser cutting with in-line defect detection systems. Machine vision cameras perform 100% inspection of cut edges at 25μm resolution, automatically flagging any deviations beyond preset parameters. The integrated cleaning station removes microscopic debris using ultrasonic technology, ensuring surface cleanliness suitable for optical bonding. For quality validation, the system generates digital twins of each cutting process, correlating laser parameters with final edge quality. This data-driven approach has enabled Lecheng's clients to achieve first-pass yield rates exceeding 99.5% in high-volume production of foldable displays and automotive dashboards, while reducing polishing and secondary processing costs by 60%.
Lecheng's picosecond laser cutting technology redefines precision glass processing by combining cold ablation physics with intelligent automation, enabling display manufacturers to produce increasingly sophisticated designs while maintaining exceptional structural integrity and production efficiency.
