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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582
Our laser etching system integrates cutting-edge engineering for unparalleled performance:
Ultra-Stable Laser Source: Fiber/UV/Picosecond lasers with adjustable pulse duration (ns/ps/fs), wavelength options (355nm, 532nm, 1064nm), and peak power up to 50W.
High-Precision Motion System: Air-bearing granite stage with ±1μm positioning accuracy, coupled with galvanometer scanning (7mm²–300mm² FOV) for dynamic patterning.
Intelligent Control Suite:
Real-time Z-axis autofocus (resolution: 0.1μm)
CCD vision alignment for ±5μm overlay accuracy
HMI with proprietary software supporting DXF, Gerber, BMP formats
Multi-Layer Environmental Control:
Class 1000 cleanroom-compatible enclosure
Active temperature-humidity regulation (±0.5°C)
Integrated fume extraction with HEPA filtration
Modular Upgrade Path: Optional 3-axis rotary stage, in-situ profilometry, or multi-laser hybrid configuration.
Revolutionize your manufacturing with core technological edges:
Sub-Micron Precision: Achieve 5–20μm feature sizes (Ra < 0.2μm) through diffraction-limited beam shaping.
Zero-Contact Processing: Eliminate tool wear and mechanical stress for brittle materials (e.g., SiC, glass).
Adaptive Energy Control: Pulse-by-pulse power modulation (1–100% in 0.1% steps) enables selective ablation of multilayers (e.g., ITO/Ag/PET).
Speed & Efficiency: 2000 mm/s scan speed with 50g acceleration; 4x faster than chemical etching.
Eco-Conscious Operation: 30% lower energy consumption vs. competitors; no toxic etchants or wastewater.
Empowering innovation across industries:
| Sector | Use Cases | Key Benefits |
|---|---|---|
| Semiconductors | Wafer dicing, IC trimming, package marking | <10μm kerf width, zero micro-cracks |
| FPD/LED | FPC patterning, OLED encapsulation removal, touch sensor etching | Selective ablation, 99.9% yield rate |
| Solar | PERC cell drilling (10–20μm holes), thin-film scribing | 500 holes/sec, ±2μm positional accuracy |
| Medical Devices | Stent texturing, implant micro-grooving, lab-on-chip channel fabrication | Biocompatible surface modification |
| Advanced R&D | 2D material processing, metasurface creation, quantum device prototyping | Nanosecond thermal im |
Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.
MoreP-Series delivers industry-leading 120m/min cutting speed. Six-axis CNC control enables complex 3D pipe profiles. Automatic loading/unloading boosts production efficiency. Maintains ±0.1mm precision across all pipe diameters.
MoreFive-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.
MoreUltra-precise laser cutting for flexible OLED panels. Non-contact process prevents display layer damage. Automated alignment ensures micron-level cutting accuracy. Compact design fits cleanroom production environments.
MoreNon-contact laser cutting for zero material loss. High-precision slicing for superior wafer quality. Automated operation boosts production efficiency. Low thermal impact preserves SiC properties.
MoreCold Laser Processing: Cuts glass without thermal cracks or chipping. Micron-Level Precision: Achieves clean edges with ≤20μm accuracy. Multi-Layer Capable: Processes laminated/tempered glass effortlessly. Industrial Reliability: 24/7 operation with minimal maintenance.
MoreVersatile Dual Function: Precision cutting AND engraving in one compact system. Non-Material Master: Perfectly processes wood, acrylic, leather, fabric, paper. User-Friendly Operation: Intuitive software & rapid setup for instant productivity. Industrial-Grade Results: Professional quality without industrial complexity.
MoreSpace-Saving Design: Compact benchtop unit fits any workshop or office. Precision Metal Cutting: Cuts steel, aluminum, copper with razor-sharp detail. Plug-&-Play Operation: User-friendly software, minimal training required. Industrial Performance: Professional results without industrial space needs.
MoreHigh-Power Fiber Laser: Delivers superior speed & cuts thick metals effortlessly. Exceptional Precision & Quality: Achieves clean, burr-free edges on intricate contours. Energy-Efficient & Cost-Effective: Low power consumption maximizes operational savings. Versatile & Reliable: Processes diverse metals (steel, aluminum, copper) with consistent results.
MoreNanometer precision for flawless micro-scale machining. Ultrafast lasers enable clean, burr-free cuts. Multi-material compatibility for versatile applications. Automated focus control ensures consistent high quality.
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Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582