Laser Etching Equipment for Precision Industrial Surface Processing

Structural Features

Our laser etching system integrates cutting-edge engineering for unparalleled performance:

1. Ultra-Stable Laser Source: Fiber/UV/Picosecond lasers with adjustable pulse duration (ns/ps/fs), wavelength options (355nm, 532nm, 1064nm), and peak power up to 50W.

2. High-Precision Motion System: Air-bearing granite stage with ±1μm positioning accuracy, coupled with galvanometer scanning (7mm²–300mm² FOV) for dynamic patterning.

3. Intelligent Control Suite:

• Real-time Z-axis autofocus (resolution: 0.1μm)

• CCD vision alignment for ±5μm overlay accuracy

• HMI with proprietary software supporting DXF, Gerber, BMP formats

4. Multi-Layer Environmental Control:

• Class 1000 cleanroom-compatible enclosure

• Active temperature-humidity regulation (±0.5°C)

• Integrated fume extraction with HEPA filtration

5. Modular Upgrade Path: Optional 3-axis rotary stage, in-situ profilometry, or multi-laser hybrid configuration.

6. 

Technical Advantages

Revolutionize your manufacturing with core technological edges:

• Sub-Micron Precision: Achieve 5–20μm feature sizes (Ra < 0.2μm) through diffraction-limited beam shaping.

• Zero-Contact Processing: Eliminate tool wear and mechanical stress for brittle materials (e.g., SiC, glass).

• Adaptive Energy Control: Pulse-by-pulse power modulation (1–100% in 0.1% steps) enables selective ablation of multilayers (e.g., ITO/Ag/PET).

• Speed & Efficiency: 2000 mm/s scan speed with 50g acceleration; 4x faster than chemical etching.

• Eco-Conscious Operation: 30% lower energy consumption vs. competitors; no toxic etchants or wastewater.

Typical Applications

Empowering innovation across industries:

Specifications are indicative only - All equipment is fully customizable to your needs！