40px
80px
80px
80px
Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582PCB Drilling Equipment is designed for industrial laser processing projects that require stable beam control, process repeatability, and reliable integration with production requirements. For ├ Laser Integrated Processing selection, buyers should compare material type, processing accuracy, automation level, throughput, maintenance access, and after-sales support before confirming the final equipment configuration.
Related laser solutions include Consumer Electronics Laser Drilling Equipment, HDI Microvia Drilling Equipment, Laser Optics and Accessories. These internal references help users compare similar systems and move naturally between cleaning, cutting, scribing, marking, welding, and photovoltaic laser equipment pages.
This CNC drilling system achieves ±0.01mm precision for 0.1-6.5mm holes (800 holes/min), compatible with FR4, aluminum and high-frequency substrates. Ideal for HDI boards and IC substrates, it combines multi-axis control with intelligent tool management for high-end PCB manufacturing.



Component | Specification | Value |
|---|---|---|
Spindle | 160krpm air-bearing (≤1μm runout) | 30% tool life extension |
Positioning | Linear motor (±0.01mm) | 50% accuracy improvement |
Tool Changer | 60-tool auto-changer (3s) | 72h continuous operation |
Dust Removal | HEPA filtration | <0.1mg/m³ particulate |
Quality:Ra≤3.2μm hole walls, minimizing plating voids
Cost Saving:45% energy reduction, 60% less tool wear
Smart Ops:AI predictive maintenance (≥95% accuracy)
Flexibility:Blind/buried via & back-drilling capable
Consumer Electronics:0.15mm holes for smartphone PCBs
5G Infrastructure:RF material drilling
Auto Electronics:EV control module multilayer boards



40px
80px
80px
80px
Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582