Products

Featured products

Fully Automatic Thin-film Photovoltaic Laser Scribing Equipment

Picosecond Glass Laser Cutting System

Laser High-Precision Micro-Machining Equipment

3D Laser Cutting Machine

Laser Glass Cutting & Breaking All-in-One Machine

Photovoltaic (PV) Cell Laser Scribing Machine

Roll-to-Roll Laser Scribing & Edge-Cleaning System

LED Solar Simulator

Multi-Channel PV Module Steady-State Testing System

PCB Drilling Equipment

Consumer Electronics Laser Drilling Equipment

High-Precision 5-Axis Simultaneous Laser Processing System

Dual-Chuck Laser Tube Cutting Machine

P-Series High-Speed Laser Tube Cutting Machine

Laser Metal 3D Printer

HDI Microvia Drilling Equipment

Flexible OLED Laser Cutting System

Wafer Laser Annealing System

Handheld Laser Cleaning Gun

Robotic Laser Welding Cell

Power Battery Welding Line

High-Power Fiber Laser Cutting Machine

Laser Cladding Machine

Silicon Carbide Ingot Laser Slicing System

Micro LED Laser Mass Transfer System

Backpack Laser Cleaner

Handheld laser cleaner

Cabinet Laser Cleaning Machine

CO2 laser engraving machines

Desktop metal laser cutter

Fiber laser cutter

Dual-Station Solder Paste Laser Welder

Handheld Laser Welder

Air-Cooled Handheld Laser Welding Machine

Green Laser Marking Machine

UV laser marking machine

CO₂ Laser Marking Machine

Fiber laser marking machine

Laser Etching Equipment

Laser Welding Equipment

Integrated Processing Equipment for Thin-Film Solar Cells

Multi-Station Laser Marking & Cutting System

Contact us

Lecheng Intelligence Technology (Suzhou) Co., Ltd.

Address

J Building, Sound Valley Innovation Accelerator Center, Changshu Economic Development Zone, Changshu City, Jiangsu Province, China

Address

jack@le-laser.com

Phone

+86-17751173582

Fax

Perovskite laser production line, Laser Scribing Machine

Perovskite laser production line Laser Scribing Machine Laser Edge Isolation Equipment Laser Marking Equipment Laser engraving machine Laser Integrated Processing Laser Cutting Equipment Laser Welding Equipment Photovoltaic Solar Testing Equipment

Consumer Electronics Laser Drilling Equipment
Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.
Consumer Electronics Laser Drilling Equipment Micro Laser Drilling MachinePCB Microvia Drilling SystemPrecision Laser Drilling EquipmentConsumer Electronics Laser Processing Email More
High-Precision 5-Axis Simultaneous Laser Processing System
Simultaneous 5-axis control enables complex 3D part machining. Integrated rotary table processes large curved surfaces. Smart collision avoidance ensures uninterrupted production.
High-Precision 5-Axis Simultaneous Laser Processing System 5-Axis Laser Cutting MachineMulti-Axis Laser Processing SystemHigh-Precision Laser Machining CenterCNC 5-Axis Laser Cutter Email More
Dual-Chuck Laser Tube Cutting Machine
Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.
Dual-Chuck Laser Tube Cutting Machine Twin-Spindle Tube Cutting SystemHigh-Productivity Laser Pipe CutterContinuous Feed Tube Laser MachineUninterrupted Laser Tube Processing Email More
P-Series High-Speed Laser Tube Cutting Machine
P-Series delivers industry-leading 120m/min cutting speed. Six-axis CNC control enables complex 3D pipe profiles. Automatic loading/unloading boosts production efficiency. Maintains ±0.1mm precision across all pipe diameters.
P-Series High-Speed Laser Tube Cutting Machine Laser Tube CutterHigh-Speed Tube Cutting SystemCNC Laser Pipe Cutting MachineIndustrial Tube Laser Cutter Email More
Laser Metal 3D Printer
Precision laser melting builds complex metal parts layer by layer. Closed-loop control ensures consistent high-density part quality. Multi-material capability for titanium, steel, and alloys.
Laser Metal 3D Printer Metal 3D PrinterLaser Powder Bed FusionIndustrial Metal Additive PrinterDMLS 3D Printing Machine Email More
HDI Microvia Drilling Equipment
Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
HDI Microvia Drilling Equipment Laser PCB Drilling SystemHigh-Density Interconnect DrillerPrecision Micro-hole Drilling EquipmentPCB Laser Via Machine Email More
Flexible OLED Laser Cutting System
Ultra-precise laser cutting for flexible OLED panels. Non-contact process prevents display layer damage. Automated alignment ensures micron-level cutting accuracy. Compact design fits cleanroom production environments.
Flexible OLED Laser Cutting System OLED Panel Laser Cutter Foldable Display Cutting SystemPrecision OLED Laser ProcessingThin-Film Display Cutting Equipment Email More
Wafer Laser Annealing System
Ultra-precise laser annealing for advanced chip manufacturing. Uniform energy distribution ensures consistent wafer treatment. Non-contact process prevents semiconductor surface damage. Automated calibration adapts to various wafer specifications.
Wafer Laser Annealing System Semiconductor Laser AnnealerLaser Thermal Processing EquipmentSilicon Wafer Annealing MachinePrecision Laser Annealing Tool Email More
Handheld Laser Cleaning Gun
Eco-friendly laser cleaning replaces chemical treatments. Precision cleaning without damaging base materials. Lightweight design enables easy operation anywhere. Low maintenance with long-lasting fiber laser source.
Handheld Laser Cleaning GunPortable Laser Cleaning MachineLaser Rust Removal Tool Industrial Laser Cleaning GunMobile Laser Surface Cleaner Email More
Robotic Laser Welding Cell
High-speed robotic laser welding for precision manufacturing. Flexible automation adapts to complex welding applications. Energy-efficient system reduces operational costs significantly.
Robotic Laser Welding Cell Automated Laser Welding SystemIndustrial Robot Welding CellLaser Welding AutomationCNC Laser Welding Machine Email More

Demystifying Beam Splitting Technologies in Perovskite Photovoltaic Laser Processing

The transition to gigawatt-scale perovskite solar production hinges on precision laser processing, where beam splitting technology plays a pivotal role. By dividing a single laser source into multiple beams, this technique enables simultaneous scribing of P1-P3 patterns and edge isolation (P4), directly impacting throughput, dead zone control, and production costs. Current industrial approaches primarily include mechanical beam splitting and diffractive optical elements (DOEs), each with distinct advantages for perovskite’s thermal sensitivity and scalability requirements.
More
The Application of Laser Technology in the Industrialization of Perovskite Solar Cells

Perovskite solar cells (PSCs) represent the third generation of thin-film solar technology, renowned for their high efficiency, low cost, and flexibility. As industrialization progresses, laser technology has emerged as a critical enabler, addressing key challenges in precision processing and scalability. This article explores the multifaceted role of lasers in PSC manufacturing.
More
Roll-to-Roll (R2R) Laser Scribing System for Thin-Film Solar Cells

The equipment utilizes a high-energy-density laser beam, precisely controlled by a computer system, to process roll-to-roll thin-film solar cell materials according to pre-programmed scribing patterns. Through laser thermal or cold processing effects, the thin-film material is instantaneously vaporized, separated, or modified, achieving precise scribing to either segment the cells or create specific circuit patterns on them.
More
Perovskite Photovoltaic Module

Lecheng's laser scribing equipment, equipped with a high-precision laser control system, achieves micron-level patterning accuracy with smooth, thermally damage-free edges. This significantly reduces internal resistance losses in solar cells, pushing power conversion efficiency to industry-leading levels—perfectly meeting the high-power output demands of mass production.
More
High-Precision Laser Micromachining Equipment

Laser high-precision micromachining technology achieves material processing through precise control of core parameters such as wavelength, pulse width, and energy density, utilizing either thermal or cold processing mechanisms. This induces instantaneous material vaporization, melting, or modification, enabling operations such as cutting, drilling, engraving, and surface treatment. It stands as a pivotal technology in high-precision manufacturing.
More
Customer Acclaim

This prestigious accolade has significantly elevated Lecheng Intelligent's industry visibility and reputation, distinguishing it as a trusted leader among suppliers. The recognition solidifies its competitive edge and lays a robust foundation for market expansion.
More

Products

Featured products

Contact us

Perovskite laser production line, Laser Scribing Machine

Get Quote