Products

Featured products

GLC11-300-300 Glass Laser Cutting And Breaking Machine

GLC11-300-300 Glass Laser Cutting And Breaking Machine

Glass Laser Cutting And Breaking Machine

Glass Laser Cutting And Breaking Machine

Outdoor Multi-Channel Photovoltaic Module Steady-State Test System

Outdoor Multi-Channel Photovoltaic Module Steady-State Test System

Desktop Multi-Light Laser Engraving Machine

Desktop Multi-Light Laser Engraving Machine

LC-LED-AAA-2400 Steady-State Solar Simulator

LC-LED-AAA-2400 Steady-State Solar Simulator

Fully Automatic Thin Film Photovoltaic Laser Scribing Equipment

Fully Automatic Thin Film Photovoltaic Laser Scribing Equipment

MCT-OD Outdoor Multi-Channel IV/MPPT Field Validation Test System

MCT-OD Outdoor Multi-Channel IV/MPPT Field Validation Test System

Roll to Roll Laser Scribing Edge Cleaning System

Roll to Roll Laser Scribing Edge Cleaning System

Contact us

Lecheng Intelligent Technology Suzhou

Address

J Building Sound Valley Innovation Accelerator Center Changshu Economic Development Zone Changshu City Jiangsu Province

Address

Email

jack@le-laser.com

Phone

+86-17751173582

Fax

Pcb Laser Via Machine

HDI Microvia Laser Drilling Equipment for PCB Manufacturing
Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
HDI Microvia Laser Drilling Equipment for PCB Manufacturing Laser PCB Drilling System High-Density Interconnect Driller Precision Micro-hole Drilling Equipment PCB Laser Via MachineEmail More

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Lecheng Intelligent Technology Suzhou

Address

J Building Sound Valley Innovation Accelerator Center Changshu Economic Development Zone Changshu City Jiangsu Province

WhatsApp

Email

jack@le-laser.com

Phone

+86-17751173582

Fax