Comprehensive Technical Solutions for the Entire Field of Laser Precision Machining：
1. Laser Precision Marking
Full-material compatibility: Permanently marks metals, plastics, ceramics, glass, and more with micron-level precision
Advanced identifiers: Supports QR codes, serial numbers, and complex graphics engraving for traceability
Critical applications: Widely used in high-end traceability fields including electronic components, medical devices, and aerospace
2. Ultra-thin Glass Laser Precision Cutting
Breakthrough technology: Enables fragment-free cutting of 0.1–2mm ultra-thin glass, overcoming traditional limitations
Edge strength innovation: Proprietary thermal stress control boosts edge strength by 300%
Revolutionary solutions: Core technology for foldable displays, automotive screens, and photovoltaic substrates
3. High-Stability Laser Welding Systems
Dissimilar material expertise: Solves welding challenges for copper-aluminum alloys with ±5μm thermal deformation control
Customized key processes: Develops hermetic sealing for EV batteries and gas-tight welding for sensors
Industry-leading yield: Achieves **>99.8% welding yield** to enhance smart manufacturing efficiency
4. Micro-nano Laser Etching Equipment
Ultra-fine capabilities: Minimum line width of 5μm, supporting curved-surface super-fine patterning
High-end applications: Critical for semiconductor lead frames, PERC solar cells, and precision mold texturing
Technology driver: Accelerates R&D in flexible circuits and next-gen microelectronics
5. Laser Precision Cutting
(1) Metal Cutting
Accuracy: ≤10μm for metals (steel, aluminum, tungsten) under 2mm thickness.
Thermal control: Heat Affected Zone (HAZ) <30μm.
Applications: Medical implants, precision instruments
(2) PCB/FPC Circuit Board Cutting
Precision: ≤10μm accuracy with HAZ <30μm.
Technology: High-speed galvanometer scanners for efficiency
(3) Glass Cutting
Thickness range: 0.05–10mm; edge chipping <30μm.
Key uses: Display panels, photovoltaic substrates, hermetic glass lids
