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Lecheng’s comprehensive approach—combining high-speed multi-beam processing, intelligent automation, and adaptable laser technologies—positions the company as a key enabler of high-throughput perovskite manufacturing. By addressing both scalability and precision, Lecheng helps solar producers lower costs while pushing the boundaries of cell efficiency.

In the race to commercialize high-efficiency perovskite solar modules, precision laser processing is not merely an optional manufacturing step; it is a fundamental enabler. By minimizing dead zones, preserving material integrity with ultra-low thermal impact, and ensuring reproducibility across large areas, companies like Lecheng Intelligent are providing the essential tools to unlock the full potential of this promising technology. The path to higher module efficiency is, quite literally, being carved by laser light.

Lecheng’s multi-beam synchronized processing represents more than a technical upgrade—it’s a paradigm shift in solar manufacturing. By combining unprecedented speed with sub-micron precision, the technology empowers manufacturers to meet global clean energy demands while driving down costs, setting a new standard for the industry’s future.

The Multichannel Photovoltaic (PV) Module Steady-State Testing System series (MCT series) is an advanced high-throughput platform designed for evaluating the performance and stability of perovskite, tandem, and crystalline silicon PV modules. By integrating optical, electrical, thermal, and software technologies, the system enables simultaneous testing of multiple modules under controlled conditions, accelerating R&D and quality control processes.

A major hurdle for perovskite solar cells has been the sensitivity of the materials to ambient air during manufacturing, which typically requires energy-intensive, inert-gas environments. A groundbreaking solution comes from Nanchang University, where researchers developed a novel "laser annealing" technique.

With the continuous innovation of MEMS technology, MEMS devices are widely used in consumer electronics, medical equipment, and aerospace applications, offering significant value due to their compact size, high speed, reliability, and low cost. MEMS packaging is a critical step in MEMS device development.