40px
80px
80px
80px
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582Silicon carbide ingot laser slicing system provides non contact cutting for SiC wafer preparation. High precision laser processing helps reduce material loss and improve slicing consistency. Suitable for semiconductor materials advanced wafer processing and SiC production applications.
EmailMore
40px
80px
80px
80px
Lecheng Intelligence Technology (Suzhou) Co., Ltd.
Phone
+86-17751173582