Products

Featured products

Contact us

News

  • Laser Etching Equipment: Achieving 5μm Line Widths for Semiconductors
    2026
    03-18
    The pursuit of 5μm line widths in laser etching is more than a technical specification; it is a gateway to the next wave of micro-device innovation. It represents the point where laser processing transitions from macro-structuring to true micromachining, enabling the creation of features that define the performance of cutting-edge semiconductors, photonics, and medical devices. This achievement hinges on the integration of ultrafast lasers, nanometer-precise motion control, and intelligent software. For companies like Lecheng Intelligent, developing and providing this capability is about equipping pioneers with the tools to build the future—one meticulously etched micron at a time. In the micro-scale world, precision is not just a metric; it is the foundation of function.

    40px

    80px

    80px

    80px

    Get Quote