The transition from wet chemical etching to picosecond laser ablation for coverlay opening represents a significant technological leap forward. Lecheng Intelligent is at the forefront of this shift, providing manufacturers with a tool that enables higher precision, greater design freedom, improved sustainability, and enhanced production efficiency. As FPCs continue to become smaller and more complex, Lecheng's laser technology is poised to become the new industry standard, empowering the next generation of electronic innovation.
