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Lecheng Intelligent Technology Suzhou
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+86-17751173582Precision laser melting builds complex metal parts layer by layer. Closed-loop control ensures consistent high-density part quality. Multi-material capability for titanium, steel, and alloys.
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Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.
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Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.
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Ultrafast laser scribing enhances solar cell production efficiency. Non-contact processing prevents silicon wafer micro-cracks. Automated alignment ensures ±5μm precision for all cell types.
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Integrated laser scoring/breaking eliminates secondary processing. CO₂ laser creates smooth edges without micro-cracks. Patented force control ensures consistent 100μm accuracy.
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Five-axis robotic cutting for complex 3D metal parts. High-power fiber laser handles thick and thin materials. Precision ±0.05mm cutting for automotive components. Smart programming reduces material waste significantly.
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Sub-50μm laser drilling for advanced HDI boards. Ultra-fast positioning enables high-throughput production. Automatic focus control ensures consistent hole quality. Compact footprint fits existing PCB production lines.
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Handheld laser cleaner supports portable non contact cleaning for rust paint oxides and surface contaminants. Lightweight operation improves flexibility for equipment maintenance molds welds and field repair. Suitable for industrial cleaning metal restoration and eco friendly surface preparation.
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Cabinet laser cleaning machine provides enclosed non contact cleaning for metal parts and industrial components. High power laser cleaning removes rust coating and oxides while supporting safer dust controlled operation. Suitable for workshops automated cleaning cells and precision maintenance processes.
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Micro LED laser mass transfer system supports high speed transfer of micro LED arrays with micron level accuracy. Non contact laser processing helps reduce chip damage and improve production consistency. Suitable for display manufacturing pilot lines and advanced optoelectronic production.
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80px
80px
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Lecheng Intelligent Technology Suzhou
Phone
+86-17751173582