Products

Nanometer precision​​ for flawless micro-scale machining. ​​Ultrafast lasers​​ enable clean, burr-free cuts. ​​Multi-material compatibility​​ for versatile applications. ​​Automated focus control​​ ensures consistent high quality.

Ultrafast laser scribing enhances solar cell production efficiency. Non-contact processing prevents silicon wafer micro-cracks. Automated alignment ensures ±5μm precision for all cell types.

LED simulator delivers precise AM1.5G output with stable irradiance. Adjustable intensity ensures flexible testing for PV materials. Real-time LED temperature control maintains consistent light quality. Clean interface enables easy spectral and irradiance adjustments.

Achieves 50μm micro-holes for HDI circuit boards. 6-spindle design boosts throughput by 300%. Automatic tool changer enables 24/7 operation. ±5μm positioning ensures perfect via alignment.

Achieve 10μm ultra-fine holes for advanced micro-electronics. UV laser technology prevents thermal damage to substrates. Automated material handling guarantees 99.8% drilling accuracy. Compact design integrates seamlessly into SMT production lines.

Simultaneous 5-axis control enables complex 3D part machining. Integrated rotary table processes large curved surfaces. Smart collision avoidance ensures uninterrupted production.

Dual-chuck design enables non-stop material processing. Synchronous cutting/loading doubles production output. Precision servo control maintains ±0.08mm accuracy. Smart chuck synchronization eliminates material waste.

P-Series delivers industry-leading 120m/min cutting speed. Six-axis CNC control enables complex 3D pipe profiles. Automatic loading/unloading boosts production efficiency. Maintains ±0.1mm precision across all pipe diameters.

Precision laser melting builds complex metal parts layer by layer. Closed-loop control ensures consistent high-density part quality. Multi-material capability for titanium, steel, and alloys.

Ultra-precise laser cutting for flexible OLED panels. Non-contact process prevents display layer damage. Automated alignment ensures micron-level cutting accuracy. Compact design fits cleanroom production environments.